| With the progress of the times, the development of science and technology, flexible display(FOLED) because of its thinner, more resistance to impact and flexible advantages more and more be taken seriously, flexible display substrate as the basis of research and development of flexible display, also is a major concern. Compared with glass, polymer, grapHene materials, metal materials because of its low thermal expansion coefficient, water oxygen isolation performance is superior, convenient access to raw materials and low cost is considered to be the flexible display substrate material of choice. 304 stainless steel because of its its thin, lightweight, durable, large storage capacity, the design freedom, deflection, winding and impact resistance and other properties, or will become the main substrate material of flexible display.In order to realize the flexible display substrate thin, big size,and the follow-up process to achieve seamless docking device, the best way is to the Roll- to- Roll continuous ultra precision, chemical mechanical polishing technology is considered to be one of the best technological process which reach to the requirements of the surface roughness and surface roughness.Research mainly in the polishing slurry formula, polishing process parameters and chemical polishing mechanism three aspects to analyze test, and get good performance of polishing slurry, suitable process parameters for the polishing slurry and the chemical polishing mechanism of main ingredients the chemical polishing slurry.Study on the basic polishing slurry,analysis method by single factor experiment, understand the effects of changes of type and concentration about abrasive, concentration of oxidant, pH regulator and dispersant in the polishing slurry on polishing results,two polishing slurries are obtained by orthogonal test and SAS variance analysis,hydrogen peroxide- oxalic acid: 2.8 wt % w3.5 white fused alumina, 1.9 wt % sodium hexametaphosphate, 1.5 wt % oxalate, 5.6 wt % of hydrogen peroxide, 0.04 wt % sodium hexadecyl; ferric trichloride- oxalic acid polishing liquid :3.8 wt % w0.5 white corundum, 1.8 wt % glycerol, 1.8 wt % oxalate, 5.4 wt % iron trichloride, 0.2 wt % oxygen nonylphenol vinyl ether. And the coarse threw and half fine scheme are made.In consideration of the advantages and the existence questions of the two basic polishing slurries, so mix the two basic polishing slurries and test polishing effect of 304 stainless steel, can be obtained by adjusting the concentration of hydrogen peroxide solution and ferric chloride to adjust the polishing rate and surface quality.Hydrogen peroxide- ferric trichloride polishing slurry formula is obtained by orthogonal experiment and variance analysis : 2.8 wt % w0.5 white corundum, 1.8 wt % glycerol, 1.8 wt % iron trichloride, 1.8 wt % oxalic acid, 1.8 wt % nonylphenol oxygen ethylene ether, 3.6 wt % hydrogen peroxide. And make the rough cast, half fine buffing, fine buffing solution.Finally, analysis on polishing mechanisms of the major components in polishing slurry. It proved that 2Fe3 ++ Fe → 3Fe2+ reaction and Fenton reaction 2Fe2+ + H2O2 + 2H+ → 2Fe3+ + 2H2 O exist in hydrogen peroxide and ferric chloride, furthermore,ferric ions formed in the reaction can occur hydration forms complex compound [Fe(H2O) 6] 3+, it continues to react with water to form a more complex iron complexing substances, these complexes can be attached to the surface of 304 stainless steel, filled with depression, prevent low-lying place from further corrosion, improve the surface quality. XRD technique is used to prove hydrogen peroxide- ferric chloride polishing slurry does not change the original matrix pHase of 304 stainless steel, it demonstrated that 304 stainless steel polished by the slurry does not lose its proper performance.Study the polishing process parameters on the 304 stainless steel polishing rate and the influence of surface quality, to develop a suitable polishing process parameters. Improve the polishing disk rotational speed, material removal rate rising, but the speed decreases high surface quality.Increase the polishing pressure, material removal rate rising, the surface roughness change with pressure has ups and downs.Increase the polishing liquid flow, material removal rate is on the decline, the surface roughness increase after first decreased.Polishing temperature rising, the material removal rate continued to decline, rough surface is also falling.Polishing time more than 15 minutes, as the polishing time increased, the material removal rate change is not obvious, but the surface roughness has a significant decline. |
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