In the dissertation, the recent progress on the study of polyamides, polyimides and poly(aryl ether ketone)s were introduced. This paper was mainly composed of three parts as follow.1. 4-(Diphenylphosphino)-benzaldehyde was prepared by triphenylphosphine and 4-bromobenzaldehyde. Then the treatment of 4-(diphenylphosphino)-benzaldehy--de with 4-nitroacetophenone through a modified Chichibabin reaction obtained 4-(4'-diphenylphosphino)phenyl-2,6-bis(4'-nitrophenyl) pyridine(DPPPBNPP), which was reduced into a new kind of the novel diamine containing a heterocyclic pyridine substitute and triphenylphoranylidene pendant group, 4-(4'-diphenylphosphino) phenyl-2, 6-bis(4'-amniophenyl)pyridine(DPPPBAPP) with Pa/C and hydrazine monohydrate. The new diamine(DPPPBAPP) was used to prepare several aromatic polyamide bearing pyridine and triphenylphosphine moieties via low-temperature polymerization with four different alkane-dioyl dichlorides containing isophthaloyl chloride(IPC), terephthaloyl chloride(TPC), etc. The inherent viscosities(?inh) of the synthesized polymers were ranging from 0.50 to 0.93 d L/g. These polymers were soluble in dipolar solvents at room temperature such as N-methyl-2-pyrrolidone, dimethyl formamide, N, N'-dimethylacetamide and partly soluble in chloroform. All polymers were amorphous, and exhibited glass transition temperatures in range of 317–383 oC, the temperatures of 5 % weight loss in range of 458–505 oC, the temperatures of 10 % weight loss in rang of 482– 554 oC, and the residual weight in range of 63-71 % in argon. In addition, all the PAs films exhibited good mechanical properties with tensile strengths in range of 60–80 MPa, elongations at break in range of 4.95–7.75 %, and tensile modulus in range of 1.09–2.31 GPa, which suggested that these new PAs could be considered as new potential engineering plastics. All films were transparent with more than 86 % of transmittance at 800 nm light-wavelength, and the cutoff wavelength in range of 380-395 nm.2. A series of aromatic polyimides were achieved with the diamine(DPPPBAPP) and different aromatic dianhydrides, such as ODPA(a), 6FDA(b), BPDA(c) and BTDP(d), via the conventional two-step method, involving ring-opening polycondensation forming the poly(amic acid)s(PAAs) and further imidization forming polyimides. The chemical imidization of PAA-a and PAA-b by dehydrating obtained soluble PI-a and PI-b with inherent viscosities of 0.35 and 0.38 d L/g, which dissolved both in aprotic organic solvents, such as NMP, DMF, DMAc, DMSO, and in common solvents, such as THF and CHCl3. Other polyimdes using thermal imidization achieved insoluble PI-c and PI-d, which the inherent viscosities of corresponding poly(amic acid)s were 0.51 and 0.49 dL/g. Besides, PI-c and PI-d films had a tensile strength of 65 and 81 MPa, a Young's modulus of 1.2 and 1.9 GPa. Two polymers exhibited low optical transparency, only 71% and 53% of transparence at 800 nm light-wavelength. In addition, all the polyimides behaviored excellent thermal properties with high glass transition temperature(Tg) in range of 300-380 oC, and the decomposition temperature( at 5 % weight loss) of above 517 oC.3.A new kind of pyridine-bridged and triphenylphosphine substituents aromatic bisphenol monomer, 4-(4'-diphenylphosphino)phenyl-2, 6-bis(4'-hydroxyph--enyl) pyridine(DPPPBHPP), was successfully synthesized by a modified Chichibabin reaction of 4-(diphenylphosphino)-benzaldehyde with p-hydroxyaceoph--enone. Then, The bisphenol(DPPPBHPP) was employed to synthese a series of new poly(aryl ether ketone)s with pyridine-triphenylphosphine by the high-temperature solution polycondensation with various bisfluoro compounds, which included 4, 4'–difluorobenzophenone; 1, 3-bis(4-fluorobenzoyl)benzene; 4, 4'-bis(4-fluorobenz--oyl)biphenyl and 4, 4'-bis(4-fluorobenzoyl)diphenyl ether. Their inherent viscosities ranged from 0.30 to 0.53 d L/g, and nearly all of the polymers were readily soluble in commom organic solvents sunch as NMP ? DMSO ? DMF ? THF and CH2Cl2. Meanwhile, these polymers were amorphous and maintained outstanding thermal stability with glass transition temperature up to 220 oC. Among them, PEK-a and PEK-b showed high thermal-decomposition temperatures at 383 oC and 353 oC, respectively. And 10 % weight loss temperatures in Ar2 were above 440 oC. |