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Preparation And Study On The Properties Of Acrylic Resin And Acrylic Composites

Posted on:2018-07-05Degree:MasterType:Thesis
Country:ChinaCandidate:T ShenFull Text:PDF
GTID:2321330512983197Subject:Chemical Engineering and Technology
Abstract/Summary:PDF Full Text Request
Acrylic resin is a kind of polymer copolymerized by acrylic monomers that containing unsaturated double bond.Due to the lively and diversity substituent of the monomers make it has a lot of excellent performance,such as good glossiness,weather fastness and stability,widely used in electronic materials,adhesives,optical materials,biomedical materials and other fields.In this thesis,focusing on the demand of the mounting material in the field of Printed Circuit Board(PCB),a scientific research was implemented about the two-component curing acrylic resin at room temperature and the application in the field of metallographic test.Radical polymerization is the basic mechanism of preparation of acrylic resin,the ratio between monomers and polymerization has important influence on the properties of the resin.The curing time,volume shrinkage and thermal stability were tested by FT-IR and DSC in the reaction which methyl methacrylate(MMA)and glycidyl methacrylate(GMA)as the comonomer in component A,BPO/DMT as the redox system,respectively.The result showed that when the content of GMA was 0.25 in component A,BPO/DMT=5,the performance of the resin after curing was the best.Adding inorganic filler can improve the application performance of the resin.Focused on the demand of the mounting material in the field of PCB,the modificated nanoparticles(nano SiO2,nano TiO2 and nano CaCO3)were choosed as the filler in the substrate which obtained preliminarily.The influence of the filler's morphology,proportion and properties on the resin was studied,and obtained the SiO2/acrylic resin,TiO2/acrylic resin and CaCO3/acrylic resin.After testing by SEM,DSC and mechanical test,the results showed that the three fillers can evenly dispersed in the acrylic resin and the properties of composite materials had greatly ascend.When the content of TiO2,SiO2 and CaCO3 was 0.1wt%,0.2wt% and 0.5wt% in the component A,the tensile strength,bending strength and bonding shear strength were the largest,upgraded 81.2%,56.67% and 52.87%,respectively.The mounting material is one of the necessary materials in the metallographic testing.The transparency,curing time and processing performance are the important parameter.Characterized by using contact angle measurement and metallographic test,compared with Xi'tie resin,the result showed that,the new acrylic resin as the mounting material,was transparent,fully wetting and coating with the metallographic specimen.The section was flat and smooth,the color was bright with macroscopic observation and had the effect of specular reflection after curing.The interface was clear between the resin and copper wire,no lamination speared,achieved the goal of metallographic test.
Keywords/Search Tags:acrylic resin, composite material, printed circuit board, metallographic test, mounting material
PDF Full Text Request
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