Uniform Heating And Constant Temperature Control Technology Of Electronic Packaging Mold

There are temperature differences on plastic electronic packaging mold surface or temperature control is not accurate enough,the hot pressing will cause the plastic(e.g.epoxy resin film)warping and failure.The uniform heating and constant temperature control technology of the electronic packaging mold can reduce the temperature difference in the surface of the packaging mold and improve the precision of temperature control,and further improve the packaging process.The purpose of this article is to design the heating structure and constant temperature control system of electronic packaging mold,the focus of the study is to decrease the temperature difference of packaging mold surface and improve the precision of temperature control,so as to meet the requirements of the packaging process.The main research contents of this paper are:(1)According to the structure of the mold,the heating structure is designed,and the temperature difference between the surface of the mold is reduced by the partition heating design.Finally,the thermal field analysis is carried out by using ANSYS,and the design result is verified theoretically.(2)According to the precision of temperature control,through the analysis of the mechanism model mold heating process method,genetic algorithm is used for selecting the response curve to identify the parameters of the mathematical model,and ultimately determine the transfer function of mold heating process.Select control strategy and use Fuzzy-Smith predictive compensation control algorithm to improve the accuracy of temperature control.Finally,the simulation results are verified by MATLAB simulation.(3)Design the hardware and software of temperature control system,to make a complete set of temperature control system solutions.(4)Carry out the system debugging and experiment,to verify whether the design plan to achieve the required indicators.