| Semiconductor laser has compact structure,small volume,low input energy,long life cycle,easy modulation and stable performance,which has become the core product of optoelectronic science today.As a new type of solid state light source,semiconductor laser have extremely extensive application prospect in communication,industrial engineering,sensors,laser radar and laser display area,it has infiltrate into other areas.As the main pump sources of fiber laser,solid laser and optical amplifier,high power 980 nm semiconductor laser is the important representative,the final laser source product have extensive applied to medical laser,cladding,fusing,welding,material processing and so on.At present,the semiconductor laser technologies are developing continuously,it has wider development space in the field of output optical power,wavelength,operating mode and so on.Along with the widely application of semiconductor laser,the requirements of the product reliability and life expectancy are stricter.The coupling technology is the important method to achieve high reliability and high output power,so coupling process is an important step in the semiconductor laser encapsulation.Fiber micro lens is the effective solution to achieve high output power and high coupling efficiency.The fiber need to be fixed after aligned with laser chip,the fixing process can use heat curing or laser curing method,however,the heat control and distribution will induce relevant stress field,which will cause the fiber lens wriggle and drift off the chip optical axis,as a result that the coupling efficiency decrease,devices performance degradation or failed.According to the actual process condition and many years' experience of semiconductor laser encapsulation,this article used computer simulation and experiment to analysis the thermal stress and strain of 980 nm semiconductor laser coupling process with fiber micro lens,expect to be helpful for the development of coupling technology. |
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