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Study On The Structural Analysis And Modification Of Epoxy Adhesive Cured At Room Temperature

Posted on:2016-06-04Degree:MasterType:Thesis
Country:ChinaCandidate:K J ZhuFull Text:PDF
GTID:2371330488481819Subject:Materials science
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Epoxy adhesive has good adhesive properties for a variety of metals and most non-metallic materials,so is often called “all-purpose adhesive”.In China epoxy adhesive has been widely used in various fields such as the automotive,civil engineering,electronics technology,aerospace and so on.As the world's second largest country in the production of epoxy resins,epoxy adhesive,while our products are still in the middle and low level on technology and unable to meet the needs of our markets.The diversified development of the domestic markets demand for epoxy are most relying on imported epoxy adhesive products.Most recent studies on the room temperature curing epoxy adhesive are focused on the ultimate performance,while the analysis of product performance and curing epoxy adhesive microstructure linking is not much.This article starts with three selected(703,diethylenetriamine,650)common room temperature curing epoxy curing agents and a reasonable room temperature curing epoxy adhesive formulated three kinds as a research base,prior understanding basic organic amine curing agent on the reaction process,room temperature curing epoxy adhesive to determine the three relationship between time and temperature through the test,and further by pulling the shear strength test,direct tension tests to understand the basic mechanics of three epoxy adhesive performance,and then shoot the tensile fracture surfaces of its fully cured by high definition scanning electron microscope,analyzed the relationship between the state of a crosslinked structure with an epoxy adhesive junction properties,and finally by infrared spectroscopy before and after the curing reaction changes its molecular groups with epoxy adhesive contact between the final performance.After the comprehensive analysis of curing at room temperature for three the structure and properties of epoxy adhesive,re-design of complex curing agent to obtain a new epoxy adhesive through modification.In this paper,there is a detailed and overall analysis on performance of modified epoxy adhesive,including the construction period applicable,curing time,tensile-shear strength,drawing strength and toughness and durability assessment.The test results show that the modified epoxy adhesive can be fully cured under normal temperature conditions and the curing reaction speed,good adhesion properties,good flexibility and excellent corrosion resistance,high temperature stability significantly It is good temperature curing epoxy adhesive with two component room which can be a versatile.
Keywords/Search Tags:Epoxy adhesive, Curing agent, Room temperature curing, Structure analysis, Infrared spectrum, modified
PDF Full Text Request
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