| With the rapid development of semiconductor industry,the research on semiconductor processing equipment is also in constant development.Because domestic research starts lately,our country have a weak foundation.the gap with foreign countries is about 20 years.The high-end equipment is monopolized by foreign countries,in which the grinding machine is one of the key equipment for the processing of semiconductor silicon materials.The domestic equipment adopts the split design,which has poor precision,low efficiency and low degree of automation.Although the import equipment has advanced performance,it cost highly and has limited capacity and long cargo period,which seriously restricts the development of China’s semiconductor industry.In order to solve this problem,the development of RGM8C1000-ZJS is developed.The purpose of this thesis is to develop a monocrystalline silicon rod grinding machine for semiconductor industry with high automation,integration,compatibility and precision.The key point of the research is to realize the automatic orientation,and to study the quality and efficiency of the rod rolling,so as to provide technological parameters and theoretical basis for the automatic grinding of crystal rods.Based on these two points,this thesis designs an online automatic orientation device,and optimizes the technological parameters through grinding theory and experiment research,and realizes the batch automation grinding function of the equipment.The online automatic orientation system is mainly composed of physical construction,X-ray diffractometer,control system and software.Its core is X ray diffractometer,software algorithm and precision transmission.Physical construction,the control system structure and HMI are designed to collect and analyze the frequency signal.By collecting and analyzing the frequency signal,we can get the directional accuracy by modifying the filter coefficient,the rotation of the crystal rod and the clearance between the reference base and the silicon bar.Aiming at the optimization of grinding parameters,the characteristics of silicon rod grinding is got based on gometrical analysis on the side grinding of silicon rod roll with cup wheel.Then the effect of grinding process parameters on grinding trace are analysied through simulation about trace of single abrasive grain with MATLAB.The effect of grinding process parameters on surface roughness are studied through the analysis of grinding surface roughness formula.The effect of grinding parameters on the removal of monocrystalline silicon rod is studied by considering the removal process of single abrasive particles.The grinding process parameters optimization model of cup wheel grinding is established according to the relationship between the roughness and the removal efficiency of grinding,when parameters of grinding process is constrained and the comprehensive effect of the processing quality and efficiency is considered.In this way,the optimum combination of grinding process parameters with cup grinding wheel is determined,and the production efficiency is improved on the premise of ensuring the grinding quality.Finally,automatic directional performance is tested and grinding quality is tested based on RGM8C1000-ZJS.In the processing efficiency maximization case,directional precision silicon rod is ±3’,surface roughness Ra<1μm,which meet the demand of semiconductor.The RGM8C1000-ZJS improves the automation of grinding process and fills the blank of automatic directional roll grinding machine processing equipment,and shorts the gap between the international. |
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