Research Of Electrode Etching Process Based On Confined Etchant Layer Technique

With the rapid development of science and technology,requirements of micro-electromechanical systems,large-scale integrated circuits,ultra-precision optical systems and other manufacturing areas for micro-nano processing technology are getting higher and higher.The traditional micro-nano processing technology has the problems of tool wear,sub-surface damage and thermal stress,while electrochemical micro-nano processing technology has attracted much attention because of its no cutting force,stable processing speed,high efficiency and good surface quality.As a new type of electrochemical induced chemical etching technology,Confined Etchant Layer Technique(CELT)not only has the advantages of electrochemical nano-processing technology,but also has no impacts from the original roughness,no loss of tools.It can process conductors,semiconductors and insulator materials as well as other hard and fragile materials.In order to meet the needs of more processing and to further promote the application of CELT,studying the process of the impact of certain parameters is necessary to achieve the precise control about the material morphology and surface quality.The results show that there is a significant coupling effect between the constrained etching process and the motion flow field.The movement of the flow field can affect the mass transfer process in the solution,thus affecting the process of electrochemical reaction,and ultimately affect the processing of the material morphology and surface quality.Therefore,on the basis of predecessors’ research,this paper explores the influence of some parameters in CELT process under the rotational flow field by simulation and experiment.The mechanism of the influence of the moving flow field on the electrode processing process is studied.This is for optimizing the processing technology,improving the accuracy of material processing and giving theoretical support to surface control.In addition,in the general electrochemical processing of microstructure,it usually needs to make complex template electrode which can only process a kind of microstructure,or to use a single electrode with a series of mechanical motion processing,but the disadvantage is inefficient and the flow field may make the processing effect difficult to be precisely controlled.The array electrode can effectively improve the mass transfer in CELT process of large area electrodes,and replace the point by point processing method to improve the processing efficiency.According to previous studies,the processing depth can be tuned by controlling the process time,so theoretically array electrodes can achieve programmable three-dimensional structure of the etching process.In this paper,the array electrode is applied to CELT microstructure processing to explore a kind of technology which does not need to make the template electrode which is complementary to the processing structure and not need the movement of electrode to produce a variety of microstructures,and extend the application of CELT.