Dynamic Compression Shear Properties Of Low Silver Lead-free Solder Based On Hopkinson Pressure Bar

Communications equipment and other electronic products work fine,need a lot of combination of electronic components and electronic components,and small size,each other only by mutual solder welded,electronic products,electronic components caused by drop impact between the solder joint damage is an important cause of damage electronic products,all kinds of materials used in electronic products of low silver solder joints,lead-free solder and its low price,good toughness,electronic products become the preferred solder,so the analysis of low silver lead-free solder is the main direction of the research on how to improve the quality of electronic products in the fall or by all kinds of mechanical behavior during the impact.In a variety of drop impact study,the constitutive relationship is particularly important,electronic products dropped or hit by its premises,solder joint force is composite plane stress,so the static and dynamic combined compression and shear loading experiments to further enrich the experimental data to improve the constitutive relationship of low Ag lead-free solder.Due to the above problems,this paper based on low Ag lead-free solder were tested by quasi-static and dynamic compression shear test under different conditions,obtained data were analyzed to study the mechanical behavior of strain rate and impact angle on the low silver lead-free solder,the main work and results are as follows:(1)To study the propagation law of compressing shear stress wave and the basic principle of separated Hopkinson compression bar,so as to get the principle of compression shear test on separated Hopkinson compression bar,and confirm the feasibility of the experiment.(2)At different strain rates and different tilt angles,of low Ag lead-free solder Sn0.3Ag0.7Cu were subjected to quasi-static and dynamic compression shear test by using the electronic universal testing machine and split Hopkinson pressure bar,and the split Hopkinson bar improved simulated numerical study found that at different tilt angles within the range of influence the mechanical properties of the strain rate and the tilt angle of the low silver solder Sn0.3Ag0.7Cu is different,in the dynamic compression shear test method,to yield strength at 30 DEG ~45 DEG by strain rate effect at 0 DEG ~30 DEG by the effect of strain rate is small,the tangential yield strength of 0 ~45 degrees affected by strain rate the effect of strain rate;0 DEG ~15 DEG and 30 DEG ~45 DEG interval was significantly higher than that of 15 ~30 degrees,the effect of strain rate of 0 ~45 degrees interval increases withthe increase of the tilt angle.