Research On Influence Of The Adhesive Layer On Thermal Boundary Conduce At Metal/Silica Interface

With the development of science and technology,the application fields of micro-nanoscale heat transfer are becoming more and more widespread.At the same time as the size shrinks,the interface density between thin films increases,so the thermal boundary conductance plays a dominant role in the heat transfer of the device.Accurate measurement and enhancement of thermal boundary conductance between thin films are important for thermal management of devices.With the development of femtosecond laser technology,Time Domain Thermoreflectance(TDTR)method has become an effective tool to study thermal transport in nanoscale structures.The metal/silica film structure is a common structure in microelectronic devices,it is difficult for heat dissipation because of its low thermal boundary conductance.There are many factors that affect the thermal boundary conductance when the materials composite the interface are determined.This article focuses on the effect of the adhesion layer on the thermal boundary conductance of the metal/silica interface.First,thermal boundary conductances of metal/silica samples containing different adhesion layers(Cr and Ti)and different metal layers(Au and Al)were measured using a dual-beam femtosecond laser measurement system based on the TDTR method.The measurement results show that the interface between the aluminum/silica has a higher thermal boundary conductance than the gold/silica interface.The existence of the Ti adhesion layer can efficaciously enhance the thermal boundary conductance between the metal/silica interface,about a factor of one increase while the effect of the Cr adhesion layer on the thermal boundary conductance between the metal/silica interface is not obvious.As a consideration of the fitting sensitivity of the measurement parameters,the experimental parameters and the sample structure were improved.The effect of Cr adhesion layer with different thicknesses on the thermal boundary conductance at the gold/silica interface was further studied.The results show that the presence of Cr adhesion layer plays an important role in the enhancement of the thermal boundary conductance at the metal/silica interface.As the thickness of the Cr adhesion layer increases,the thermal conductivity value at the gold/silica interface slightly increases,basically unchanged.The presence of the adhesion layer converts the bonding between gold and silica from physical adhesion to chemical adhesion,which improves the bonding force between interfaces,thus increasing the thermal boundary conductance at the gold/silica interface.The interface bonding forces of the samples are compared by Nano scratch test,and the result is the same trend as the thermal boundary conductance.