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The Effect On The Bonding Properties Of TA2/PEEK Interface By GO Electrophoretic Deposited On The TA2 Surface

Posted on:2019-01-25Degree:MasterType:Thesis
Country:ChinaCandidate:Y F LvFull Text:PDF
GTID:2371330596950210Subject:Materials Processing Engineering
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The Fiber Metal Laminates,Ti/C_f/PEEK(TiGr),have the advantages of both titanium and carbon fiber reinforced polyetheretheketon(C_f/PEEK)composites.TiGr has excellent fatigue resistance,good impact resistance and corrosion resistance,and also good high-temperature resistance.Those advantages make it have a great future in the aviation industry.But there is no commercial application because of the weak interface bonding strength,especially the TA2/PEEK interface.It is significant to improve the bonding strength of TA2/PEEK interface for the popularization and practical usage of this laminates.In this study,the Graphene Oxide(GO)was deposited on the surface of anodized TA2 by electrophoretic deposition.Then it was compared with the samples which had no GO deposition.With the help of SEM,Roughness test machine,FTIR,Raman specstroscopy,the morphology and properties of TA2 sheets before and after GO deposition were studied.The influence of time,voltage and GO concentration on the bonding strength and fracture toughness of theTA2/PEEK joint were studied by using the orthogonal experiment scheme combined with the single lap tensile shear test and the Double Cantilever Beam experiment(DCB).At last,the effects of GO deposition on interlayer shear strength and hygrothermal ageing performance of Ti/C_f/PEEK hybrid laminates were studied according to the result of interlayer shearing test and hygrothermal ageing experiments.The results showed that after the deposition of GO on the surface of anodized TA2,the edge of the micro-crater became blurred.GO covered boundary of the micro-pits.Since there were a large number of folds on the surface of GO,the value of micro roughness of TA2 surface increased from 0.682?m to 0.878?m.After GO deposition,the surface energy of TA2increased from 56.01 mN/m to 72.32 mN/m when it was compared with anodized TA2.According to FTIR spectrum,there were many functional groups of GO lost after 390?heat treatment,but they did not completely disappeared.It is conducive to increase affinity between TA2 and PEEk,and improve the performance of TA2/PEEK adhesive joints.According to the results of orthogonal experiment,the time of electrophoretic deposition had the most influence on the single lap tensile shear strength and interlayer fracture toughness of TA2/PEEK joint,followed by the deposition voltage and finally the GO concentration.When the electrophoretic deposition time was 1 min and the deposition voltage was 10 V,GO concentration was 1.0 mg/mL,the tensile shear strength of TA2/PEEK joint was 34.9 MPa which is maximum.And the interlayer fracture toughness value of TA2/PEEK also reached the maximum value,which was 161.7 J/m~2.They incaresed by 36.3%and 64.6%respectively when they were compared to only anodized samples.The weight of GO deposited was 6.4E-3 mg/cm~2under such parameter.Last,the Ti/Cf/PEEK hybrid laminates were prepared under the optimum GO deposition parameters.The shear strength of the laminates deposited GO was found to be 82.66 MPa,which was increased by 15.3%compared to only anodized samples.The results of hygrothermal ageing experiment showed that the final moisture absorption rate of the laminates deposited GO was 0.045%,slightly higher than the 0.04%of the laminates with no GO deposition.But the decrease rate of shear strength of the laminates deposited GO was less than samples with no GO deposition.After the hygrothermal ageing for 200 h,the residual shear strength of laminates with GO deposition was higher than the laminates with no GO.The results showed that the shear strength of Ti/C_f/PEEK interface and the performance of hygrothermal ageing were improved by electrophoretic deposition GO on the surface of TA2.
Keywords/Search Tags:TA2/PEEK joint, electrophoretic deposition, GO, interlayer shearing strength, hygrothermal ageing resistance
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