Effect Of Cold Rolling And Annealling Process On Structure And Property Of High Purity Al-0.5%Cu Alloy

In recent years,as the wiring width constantly decreases in semiconductor integrated industry,sputtering target is the main supporting materials in the semiconductor manufacturing.So the quality of it have much more effect on the metal film performance.And the high purity of Al and Al alloy are the main base materials in sputtering target materils.In the manufacturing process,how to optimize cold rolling and annealing technology,and make the sputtering target materials have more tiny and uniform microstucture and grain orientation distribution becomes especially important.This experiment using KFMI high purity 5N Al-0.5%Cu alloy material(99.999%),by means of metallographic microscope,EBSD,hardness test and tensile properties test analysis method to reseach material microstructure,internal texture,and its mechanical behavior performance of high purity Al-0.5%Cu alloy in different process in this paper.One is in different rolling process to get different rolling deformation,and other is through continuous optimize different annealing temperature and time for different material performance.In the multidirectional cold rolling process,as the increase of rolling shape variable in the high purity Al-0.5% Cu alloy materials,the grain will be stretched along the rolling direction until a significant cold rolling deformation zone.This cold rolling deformation zone is not only in favor of recrystallization crystal nucleus formation and growth,but also is conducive to the formation of recrystallization texture..For cold rolling process weakens strong texture in one-way rolling process.and decrease texture intensity.And the end to make each of the opposite sex to removed.Also in the process of multidirectional cold-rolled,high purity Al-0.5% Cu alloy would be work hardening.In the annealing heat treatment process,the greater the rolling shape variable,the more conducive to the recrystallization process,the recrystallization grain size will be smaller.In the process of annealing,the recrystallization process of high purity Al-0.5% Cu alloy is also divided into reply,the formation of recrystallization grain size and grew up stages.As the annealing temperature to the recrystallization temperature,the sample in the organization orientation difference distribution of Angle is typical of normal distribution,a marked increase in the proportion of large Angle grain boundary,and also mainly distributed in 40°~45° orientation difference Angle range,is conducive to the magnetron sputtering target material.At the moment the proportion of low Angle grain boundary falling fast.The high purity Al-0.5% Cu alloy specimens in the organization the random texture distribution and gradually weakening.Its strength and hardness of materials will decrease,plasticity significantly increased.By the analysis and the evolution law of grain morphology,grain size and texture,it will be conclude that high purity Al-0.5% Cu alloy with 90% rolling deformation and in the 280℃ and 60 min heat treatment process is a better process.Using optimization technology and the actual production verification,high purity Al-0.5% Cu alloy organization can improve the performance of sputtering target Such as the grain size decrease to 48 um,uniform distribution,texture intensity is weak,the degree of recrystallization is much more sufficient.And these performance index have reached the requirement of semiconductor sputtering target.