Design And Research Of Mechanical Loading System For The Lapping Pressure

With the miniaturization of intelligent system,instrument and meter,electronic computer,and sensor,the wide application of nano devices and the deep research of nano system performance,many tiny structures have been applied to practice.The study on mechanical properties of materials at micro scale have gradually been concerned.the general geometry of micro structures is at the micron level,and the film the thickness is at the nanometer level.High quality sample preparation technology is the basis for obtaining atomically super smooth surface.Therefore,it is urgent to solve the research and development of lapping and lapping and polishing prototype.In order to solve the problem of mechanical loading force variation curve and pressure collection during lapping and polishing process,the main factors affecting the lapping and polishing effect and the various pressure loading methods were studied.The research was carried out from two aspects of mechanical structure and control of hardware and software.A pressure loading control system was designed based on PCI-1240 U motion control card and USB bus technology.An experimental platform was built on the basis of Nano-MAX lapping and polishing machine,and the corresponding experimental research was carried out based on the experimental platform.The main research work is as follows:(1)According to the requirements of the design of lapping and polishing pressure loading platform,using MITSUBISHI HG-KN43BJ-S100 servo motor as the driving motor,the lapping and polishing force loading experiment platform was designed.The force sensor was used to detect the real-time change of loading force during the lapping and polishing process.Based on the fixed-point theory,the dynamic absorber was designed to reduce the effect of vibration on the lappingand polishing in the lapping and polishing process,and the feasibility and effectiveness of the design of the dynamic vibration absorber were explained theoretically.(2)The hardware and software for the lapping and polishing force loading control system was designed,by using the PCI-1240 U motion control card and the USB bus technology.For motor control and pressure acquisition and storage,The motion control card function,how to use LabVIEW to call the dynamic link library files,to achieve dynamic load regulation,to save the collected data and draw the curve on the screen is introduced.The human-computer interaction interface can expresses the change of loading force in the process of lapping and polishing visually.Through the man-machine interface designed by LabVIEW,the panel can be operated directly and to control the speed of the motor steadily and quickly.(3)First,the mechanical loading system of lapping and polishing machine was introduced,and the main technical parameters of the experimental platform were given.Then the main lapping and polishing parameters of the lapping and polishing process were measured and analyzed.The effect of the mechanical loading lapping and polishing was compared with the traditional weight loading lapping and polishing.The surface of the sample is characterized by Mitutoyo and Kean et al.The result shows that with the mechanical loading lapping and polishing,the surface roughness Ra obtained up to 10 nm,the surface morphology and crystal lattice arrangement is better.The feasibility of the added damped dynamic vibration absorber and the reliability of the mechanical loading system of the lapping and polishing machine are also verified.Through the mechanical and control system design,sample preparation,experimental test,and characterization,the feasibility of the vibration absorber and the reliability of the mechanical loading system of the lapping and polishing machine are proved in this paper.