Copper Clad Laminates Based On Modified Cyanate Ester Resin

Cyanate resin(CE)is a kind of thermosetting resin with excellent performance.After curing,it forms a unique triazine ring network structure,which makes the cured product have excellent heat resistance,mechanical properties and dielectric properties.Currently,CE resin and its composite materials have been widely used in the fields of electrical and electronic and aerospace.Among them,copper clad laminate is an application of CE resin in the field of electronics and electricity.However,pure cyanate resin also has the disadvantages of low toughness,high curing temperature,long curing time and high cost,which limits its application in various fields.Therefore,it is necessary to modify the cyanate resin to improve its disadvantages.In this paper,firstly,the CE resin was toughened by low molecular weight polyphenylene ether SA90 with excellent dielectric properties to prepare a CE/SA90 modified resin system.The effects of SA90 content on the properties of modified resins were studied.In addition,a composite material which is copper clad laminate was prepared by using the CE/SA90 modified resin system,glass fiber cloth and copper foil.And the properties of copper clad laminates were tested.The results show that SA90 can reduce the gelation time and promote the curing of CE.Appropriate amount of SA90 can improve the mechanical properties,dielectric properties and moisture resistance of the modified resin.By comparing the properties of the resin,when the SA90 content is 20%,the performance of the modified resin is the most excellent.Similarly,proper SA90 addition can also improve the bending strength of the copper clad laminate,reducing the dielectric constant,dielectric loss and water absorption.In addition,within the scope of this experiment,the SA90 content has little effect on the peel strength and soldering resistance of the copper clad laminate.By comparing the properties of the copper clad laminate,when the SA90 content is 40%,the copper clad laminate has the best dielectric properties.The other properties also reach the standard level,so modified resin with 40% SA90 is most suitable for the preparation of high performance copper clad laminates.Next,the CE resin was toughened with a special structure of dicyclopentadiene phenolic epoxy resin(DCPDEP)to prepare a CE/DCPDEP modified resin system,and a copper clad laminate was prepared by using the modified resin system.By studying the properties of modified resin and copper clad laminate,DCPDEP can promote the curing of CE resin,improve the mechanical properties and moisture resistance of modified resin and copper clad laminate,and reduce the dielectric loss of modified resin and copper clad laminate.By comparing the properties of the modified resin and the copper clad laminate,when the DCPDEP content is 20%,the modified resin has the best properties,and the copper clad laminate also has the best dielectric properties.In addition,within the scope of this experiment,the DCPDEP content has little effect on the peel strength and soldering resistance of the copper clad laminate.Finally,the CE resin was modified by BMI,TAIC and CE ternary copolymerization to prepare CE/BMI/TAIC copolymer resin system and copper clad laminate.The properties of the copolymer resin and the copper clad laminate were investigated.The results show that the proper amount of TAIC can promote the curing of the copolymerization system,and the excess can prolong the curing time.The proper amount of TAIC can improve the properties of the copolymer resin,so that the copolymer resin has better temperature-changing tensile shear strength and toughness,and lower dielectric constant.The properties of the synthetic resin are the most excellent when the TAIC content of the copolymer resin is 10%.Similarly,the addition of an appropriate amount of TAIC to the copper clad laminate can also improve its properties,allowing the copper clad laminate to have better flexural strength,lower dielectric loss and water absorption.In addition,within the scope of this experiment,the TAIC content has little effect on the peel strength and the soldering resistance of the copper clad laminate.By comparing the properties of the copper clad laminate,when the TAIC content is 20%,the copper clad laminate has the best dielectric properties.The other properties also better,so modified resin with 20% TAIC is suitable for the preparation of high performance copper clad laminates.