Preparation And Numerical Simulation Of Micro-nano Particles/Methyl Silicone Rubber Thermal Interface Material

With the development of technology such as nanoelectronics and three-dimensional stacked chips,heat dissipation is one of the important reasons for limiting the development of microelectronics.At present,thermal interface materials(TIMs)are mainly composed of composite materials obtained by filling the polymer with heat-conductive particles.The elasticity,insulation and thermal stability of the room temperature vulcanized silicone rubber meet the requirements of the thermal interface material,and it can complete the cross-linking vulcanization reaction at room temperature.Therefore,the solution blending method was used to fill the dimethyl silicone rubber with SiC,Al,Al2O3 and BN particles to prepare high thermal conductive insulating TIMs.The effects of single filler and multiple fillers on the properties of silicone rubber composites were investigated.In addition,the thermal conductivity model of TIM was established based on the experimental parameters using Digimat-FE modeling software and ANSYS finite element simulation software,and the thermal conductivity was solved.The particle random distribution model for predicting thermal conductivity of TIM is proposed.In the study of silicone rubber filled with single filler,the Al particles/silicone rubber TIM has a thermal conductivity of 2.396 W/m·K,a hardness of 44 HA,a low volume resistivity,and a thermal stability in accordance with the standard.The thermal conductivity of SiC particles/silicone rubber TIM is up to 1.672 W/m·K and its hardness is 58 HA.In the study of silicone rubber filled with multi-component filler,SiC/Al2O3/silicone rubber TIM has a thermal conductivity of 2.275 W/m·K and a hardness of 56 HA.When nano-Al2O3 is added,the thermal conductivity of the TIM is 1.927 W/m·K and the hardness is 46 HA.At this time,the thermal conductivity of the composite is improved and the hardness is low.In the Al/Al2O3/silicone rubber system,the thermal conductivity of the TIM is up to 2.497 W/m·K,and its hardness is 49 HA,and the volume resistivity and thermal stability are in line with the standard.In the finite element simulation analysis of silicone rubber TIMs,the particle random distribution model was proposed.The finite element numerical simulation results and experimental data of TIMs' thermal conductivity were compared,verifying that the particle random distribution model can be used for predicting the thermal conductivity of polymer matrix TIMs.