Research On Integrated Circuit Of Electronic Lock For Continuous Wave Electromagnetic Immunity Test Technology

As the core of the development of modern science and technology,integrated circuits have many advantages such as low cost,small size,fast operation speed,which have been applied in many fields.With the increasing level of integration and computing speed,integrated circuits are also more susceptible to electromagnetic interference.The electromagnetic interference of the integrated circuits will cause internal logic confusion and send out wrong signals or instructions,which leads to the decline of the working stability of the electronic product and even causes the unrecoverable burning of the integrated circuit chip.It makes the electronic products unable to work normally,and even affects the personal safety of the staff in serious cases.Therefore,the problem of electromagnetic interference of integrated circuits has received widespread attention from industry and academia.This paper takes the electromagnetic interference of intelligent electronic locks as the starting point,and studies the electromagnetic interference of integrated circuits based on the internal mechanism of electromagnetic failure of electronic locks.Firstly,by collecting the interference waveform data of the electronic lock jammer and fitting the data,the interference waveform curve is obtained,and the electromagnetic interference source is set according to the interference waveform.The electromagnetic interference simulation model of electronic lock interference coil is established,and the electromagnetic interference environment is analyzed preliminarily to guide the actual test.Secondly,the thesis uses the Transverse Electric and Magnetic Field(TEM)cell to construct the interference electromagnetic environment,builds the peripheral circuit of the integrated circuit to form a test system,and obtains the electromagnetic interference influencing factors of the integrated circuit chip.Considering the safety and rigor of the test,to build an interference electromagnetic environment,two different chips that are commonly used in electronic equipment have been tested and analyzed at radiation immunity tests.The self-developed high-power microwave TEM cell and Field Programmable Gate Array chip are used to construct an exploratory test environment.After successfully generating the required electromagnetic interference environment,it is to choose another integrated circuit chip of common electronic lock,build the basic circuit of the electronic lock functioned as a test auxiliary system,carry out the electromagnetic radiation immunity test of the integrated circuit,and explore the influencing factors of the interference coupling effect in the electromagnetic interference environment.Finally,starting from sensitive equipment,the near-field scanning experiment of the integrated circuit is carried out to observe the distribution of the near-field electromagnetic environment.The experimental results show that the coupling factors of integrated circuit under electromagnetic interference are mainly related to chip bonding wire package,interference angle and position,interference field strength and interference frequency.1)The longer the chip package bonding wire is,the more obvious the coupling effect is;2)The electromagnetic field generated by the interference coil,the package angle and the electromagnetic position of the chip in the electromagnetic field,have a certain directionality to the effect of the coupling voltage,and the chip coupling voltage is different at different angular and positions;3)The interference field strength is proportional to the electromagnetic coupling voltage;4)The influence of the interference frequency on the electromagnetic coupling is also selective,which the same experimental conditions have different frequency coupling effects.The experimental results of this paper can provide data reference for integrated circuit chip developers and application engineers to improve chip reliability,enhance electromagnetic compatibility of electronic products and avoid unnecessary electromagnetic coupling.It also provides a reference for the following electromagnetic protection and further electromagnetic compatibility exploration at the integrated circuit level.