A thermal simulation of a thin small outline package, using compact components, and a study of effect of change in TXV bulb location on the stability of a refrigeration system

In the Part I of the thesis, a detail model of 54 lead Thin Small Outline Package (TSOP) was created in Flotherm and validated against experimental data for natural convection and forced convection environments. Next, a compact two-resistor (2R) model was created in Flotherm using compact smart parts. Values of junction-to-case and junction-to-board resistances were taken from experiments. Both the detailed model and the compact model were mounted on a 4-layered standard JEDEC board for natural convection in a standard JEDEC enclosure.; Part II of the thesis, focuses on IBM's mainframe, which uses a conventional refrigeration system to maintain chip temperatures below that of comparable air-cooled systems, but well above cryogenic temperatures. Attention is given to investigate the characteristics of the thermostatic expansion valve, specifically, the effect of variation of evaporator outlet superheat on the flow through the TXV at varying evaporator temperature and the effect of sudden changes in the evaporator heat load. An expression for the evaporator time constant is developed. The bulb liquid properties are calculated at 75 F and 101.37 psi. (Abstract shortened by UMI.)...