Reduction of residual thermal stresses during bonded composite patch repair | | Posted on:2003-06-26 | Degree:M.Sc.E | Type:Thesis | | University:The University of New Brunswick (Canada) | Candidate:Djokic, Drazen | Full Text:PDF | | GTID:2461390011487982 | Subject:Engineering | | Abstract/Summary: | PDF Full Text Request | | An increasingly attractive technology for life extension of ageing aircraft is the use of bonded composite patches for repair and local strengthening of metallic structures.; The objective of the work was to develop improved process cycles to reduce residual stresses while minimizing process cycle time and still achieving a high final degree of cure. A repair was simulated using a pre-cured composite patch bonded to an aluminum substrate using FM 73 adhesive.; Investigation of standard single-step cycles confirmed the expectations of improved final adhesive characteristics and lowered process times when curing at maximum temperature levels.; A two-step curing strategy was successful in maximizing final cure properties and reducing residual stresses.; Finally, with the use of multi-step cure cycles a good compromise was achieved between lowered residual stresses and maximized adhesive properties. (Abstract shortened by UMI.)... | | Keywords/Search Tags: | Residual, Stresses, Bonded, Composite | PDF Full Text Request | Related items |
| |
|