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Reduction of residual thermal stresses during bonded composite patch repair

Posted on:2003-06-26Degree:M.Sc.EType:Thesis
University:The University of New Brunswick (Canada)Candidate:Djokic, DrazenFull Text:PDF
GTID:2461390011487982Subject:Engineering
Abstract/Summary:PDF Full Text Request
An increasingly attractive technology for life extension of ageing aircraft is the use of bonded composite patches for repair and local strengthening of metallic structures.; The objective of the work was to develop improved process cycles to reduce residual stresses while minimizing process cycle time and still achieving a high final degree of cure. A repair was simulated using a pre-cured composite patch bonded to an aluminum substrate using FM 73 adhesive.; Investigation of standard single-step cycles confirmed the expectations of improved final adhesive characteristics and lowered process times when curing at maximum temperature levels.; A two-step curing strategy was successful in maximizing final cure properties and reducing residual stresses.; Finally, with the use of multi-step cure cycles a good compromise was achieved between lowered residual stresses and maximized adhesive properties. (Abstract shortened by UMI.)...
Keywords/Search Tags:Residual, Stresses, Bonded, Composite
PDF Full Text Request
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