Research Of The Efficient Method About Stripping Multilayers Heterogeneous Connection Cables By Multi-wavelength Laser

In the electronic manufacturing industry,almost all electronic devices can't leave the active connection by wire and cable,from intelligent control to intelligent operation.Because these components are composed of layers heterogeneous materials,so it's need to strip the insulation and shielding medium layer by layer.But the traditional processing way can't meet the requirement of the processing,for example there are still problems of high cost,low accuracy and low efficiency.To solve above problems,the technology of stripping layers heterogeneous connector by different wavelength laser is proposed.Finally the accurate stripping of these components are realized.The main contents are as follows:To explore the mechanism of interaction between laser and layers heterogeneous materials.Establishing the theoretical model of CO2 laser stripping insulation materials and the theoretical model of YAG laser stripping shielding materials.Based on the finite element analysis software ANSYS,simulating the process of different wavelength laser cutting layers heterogeneous materials.Through the simulation analysis,the parameter specification of the laser device for this experiment is determined.What's more,it also offers the general range of parameters for the single factor test.Design and build the experimental platform of different wavelength laser,it can realize the transmission,processing and testing of these components.And provide the equipment for the experiment.Laser stripping experiment on the insulation and shielding layer of RG113 cable were respectively carried out using pulsed fiber laser.Influential laws of laser power,scanning speed,frequency and defocusing amount of the parts' incision width and incision depth was studied by single factor experiment.Besides,the range analysis of orthogonal experiment was adopted to analyze the influence level of different laser stripping parameters on the part's incision width and depth.It turned out that power plays the most important role on incision width and incision depth of the insulation,and power plays the most important role on incision depth of the insulation of the shielding,scanning speed plays the most important role on incision width of the insulation of the shielding.Further more,the laser stripping parameters were optimized by the comprehensive balancing.After processing,the incision width and depth of insulating layer are 0.375mm and 0.100mm,and the incision width and depth of shielding layer are 5.23um and 0.120mm.It shows that the effect of stripping is satisfactory.In order to improve the machining efficiency in actual application,designing a device for holding the parallel wire sheath which can make the RG113 cable stripped side by side.What's more,stripping other different type wire to expand the diversity of wire which can be stripped by this technology.It proves that the compensation method is correct and practical.Above researches show that the layers heterogeneous wire can be stripped precisely and efficient by the technology of stripping layers heterogeneous connector with different wavelength laser.Compared with other stripping process,the work efficiency and accuracy were increased,and the production was reduced.