Research And Simulation Of Picking Up Micro Copper Wire Based On Electrochemical Method

Micromanipulation technology is mainly used to pick up,transfer and release manipulating objects by using manipulating tools.Its development restricts the progress of micro manufacturing field.At present,micromanipulation technology is mainly used in the field of MEMS assembly,and the common method is to clamp the manipulating object with manipulating tools.In the process of manipulation,it is easy to damage the manipulating object due to excessive clamping force,and it is easy to be affected by electrostatic force and other forces when releasing,resulting in failure.In this paper,based on the analysis of the existing manipulation methods,a new meth od of metal micro component manipulation based on electrochemical deposition is proposed.The new method mainly uses the electrochemical method to produce metal deposition.Through the metal deposition,the manipulating tool pipette is integrated with the manipulating object,and then the movement of the pipette is controlled by the micro motion platform to realize the manipulation of picking up and releasing the manipulating object.This paper first analyzes the problems existing in the current mainstream manipulating methods,and proposes a metal micro component manipulation method based on electrochemistry,and analyzes the feasibility of this method.Then,the picking and releasing manipulations are modeled and analyzed to verify the feasibility of the method in theory.In view of the influence of environmental relative humidity on electrochemical deposition,the COMSOL Multiphysics finite element simulation software is used to simulate and analyze,and the best environmental conditions for the experiment are found out.On this basis,aiming at the influence factors of current density and electrolyte concentration in the process of electrochemical deposition,the simulation model of electrochemical deposition is established and the relationship between different current density,electrolyte concentration and deposition rate is found.In order to solve the problem that the relationship between electrochemical deposition rate,current density and electrolyte concentration is difficult to be determined by mathematical expression,BP neural network is used to establish the mapping relationship between them.Then,taking the determined electrochemical deposition rate as the target value,the genetic algorithm is used to optimize the various influencing factors to find the most ideal current density and electrolyte concentration parameters values.The influence factors in the picking process are analyzed,and the ABAQUS finite element simulation software is used to simulate the picking manipulation after electrochemical deposition.The stress change of metal deposition at the contact between pipette nozzle and micro copper wire and the stress change at the pipette nozzle during the picking process are studied.Through simulation,it can be proved that this method can carry out the actual picking manipulation.