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Preparation And Electromagnetic Shielding Performance Of Ti3C2Tx/Cu Composite For Aviation

Posted on:2022-02-18Degree:MasterType:Thesis
Country:ChinaCandidate:J W FuFull Text:PDF
GTID:2481306317996759Subject:Master of Engineering
Abstract/Summary:PDF Full Text Request
With the rapid development of electronic technology,the problem of electromagnetic interference has become increasingly prominent,and they are a serious threat to flight safety.Modern aircraft systems integrate a number of electrical components and sensors are vulnerable to electromagnetic interference,which affects flight safety.Therefore,the research and development of high-efficiency electromagnetic shielding materials are critical to aircraft electronic components and sensors.Due to copper high conductivity,low cost,and easy preparation,it was the first choice for electromagnetic shielding materials.However,copper is easily corroded,and its application is limited.Ti3C2Tx material is a 2D material similar to graphene.It has high conductivity,easy film formation and excellent potential in the field of electromagnetic protection.In this thesis,a non-palladium activation system was used to prepare copper-plated glass fiber fabric by the electroless copper plating.The Ti3C2Tx-based and copper-plated glass fiber-based composite materials were prepared by vacuum filtration and coating process to obtain anti-oxidation and high-efficiency electromagnetic protection materials.The main research contents are as follows:(1)An electroless copper-plated glass fiber fabric was prepared using Cu SO4-Na BH4palladium-free activation system.The influence of electroless plating process parameters on the deposition amount,deposition rate,and conductivity of the coating was studied,and the optimal parameter was obtained:14g/L Cu SO4,20g/L EDTA·2Na,12g/L C2H2O3·H2O,6 mg/L K4Fe(CN)6,p H=13,plating temperature 70?,plating time 30 min.Through SEM,XRD,XPS,and EDS analysis,the micromorphology and composition of copper-coated glass fiber fabric are analyzed under the optimal parameter.SEM showed that the copper on the surface of the fabric fiber was uniform and dense;XRD showed that the elemental copper had a face-centered cubic structure,and the copper grain size of the(111)crystal plane was 39.3 nm.By XPS and EDS analysis,the electroless plating the atomic percentage of copper was as high as 97.55%,and there was no oxide in the narrow spectrum of copper,indicating that the the plating layer was elemental copper;In 2-18 GHz,the electromagnetic shielding effectiveness of copper-plated glass fiber fabric can reach 79.45 dB.(2)The precursor Ti3AlC2 was etched by the in-situ hydrofluoric acid etching method,and the influence of the etching time on the microscopic morphology,composition,and phase composition was studied.SEM showed that the Ti3C2Tx,and the edge of the lamellae was intact after 36 h of etching.With the increase of the etching time,it caused the edge defect of the Ti3C2Tx layer;the XRD showed that the(002)characteristic diffraction peak of Ti3C2Tx appears at 2?=6.63°,the position of the(002)diffraction peak was 2?=6.63°,and it was located at2?=39.78°,and 2?=39.78°and 2?=41.75°which were the(104)and(105)characteristic diffraction peaks have the smallest intensity,indicating that there was less Ti3AlC2 remaining in the product;XPS showed that the Al element gradually disappears with the increase of the etching time.In the case of etching for 36 h,C-Ti-Tx binding energy strength was higher than that under other conditions.After analysis,it was concluded that Ti3C2Tx etched at 36 h was the best.The precursor Ti3AlC2 was etched with the optimal etching time,and the Ti3C2Tx film and MWPU composite film were prepared by the suction method.When the Ti3C2Tx film thickness was 14?m,the resistance was only 509.9 m?,and the shielding performance can reach 52.23dB.The shielding performance of the MWPU3:1 composite film was 37.9 dB,and the EMI SEAof the MWPU composite film was dominant in electromagnetic shielding.(3)The Ti3C2Tx/Glass fiber fabric and Ti3C2Tx/Cu glass fiber fabric composite was prepared by vacuum filtration and coating,and their electromagnetic shielding performance was studied.The results showed that:Ti3C2Tx nanosheets are loaded on the surface of glass fiber fabric by suction filtration.SEM showed that Ti3C2Tx nanosheets cover the surface of the glass fiber fabric,and a dense layer of Ti3C2Tx nanosheets was loaded on the surface of the glass fiber fabric to give the glass fiber fabric conductivity;XPS showed that the surface of Ti3C2Txcoated glass fiber fabric contains a large amount of-OH,-O,-F functional groups conducive to the absorption of electromagnetic waves.The electromagnetic shielding effectiveness was tested in 2-18 GHz.It was found that when the load was 2.55 mg/L,the electromagnetic shielding effectiveness reached 55.1 dB,which has excellent electromagnetic shielding effectiveness;Ti3C2Tx/Cu glass fiber fabric was prepared by coating.XRD shows that there was no copper oxide diffraction peak in the Ti3C2Tx/Cu glass fiber fabric composite,and the position of the(002)diffraction peak of Ti3C2Tx meets the requirements of standard cards;SEM showed that as the content of Ti3C2Tx increases,Ti3C2Tx nanosheets were staggered and formed.The3D conductive network of“Ti3C2Tx-Cu/glass fiber-Ti3C2Tx”improved conductivity.In 2-18GHz,when the content of Ti3C2Tx was 600 mg,the shielding performance of the composite material can reach 84.35dB.
Keywords/Search Tags:Palladium-free activation, Electroless copper plating, In-situ etching, Ti3C2Tx, Electromagnetic shielding
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