Research On Improvement Of Solder Joint Creep Failure Of Quartz Resonator

With the vigorous development of the electronics industry,the use environment of quartz resonators is becoming more and more severe,which also makes the reliability requirements of products more prominent.In many cases of product failure,solder joint failure is one of the most common forms of failure.Therefore,research on the improvement of solder joint failure has become increasingly important.At present,the most studied is the creep failure of solder joints due to temperature changes.One type of existing research focuses on the establishment of the creep constitutive equation of the solder joint and the prediction model of the life cycle of the solder joint.The other is to add different rare metals to the solder to improve the creep performance of the solder.However,these studies did not mention methods to improve the creep failure of solder joints,and to improve the solder composition under the conditions of meeting economic benefits.Therefore,the research in this paper will focus on these two aspects.In this paper,in order to improve the problem of solder joint creep failure of quartz resonator,the improvement scheme of quartz resonator package structure is proposed by the stress singularity theory in interface mechanics,and the terminal electrode structure connected with solder in the package structure is changed.The finite element method was used to simulate the solder creep before and after the improvement,and it was concluded that the stress distribution,creep deformation and fatigue cycle of the improved solder joint were optimized at the singular point accessories.Finally,it is verified by temperature cycle experiments that the improved package structure has obvious inhibitory effect on the crack growth caused by solder creep failure after multiple temperature cycles.In addition,this article also proposes to add trace elements of Bi and Ni to the low-silver solder Sn Ag0.3Cu0.7 on the premise of satisfying economic benefits.The nanoindentation method was used to compare and analyze the indentation depth and creep penetration rate of the solder before and after improvement under the same load.Through the above two methods,the risk of solder creep failure can be effectively reduced,and the reliability of the solder joint of the quartz resonator can be enhanced.And these two methods are simple and effective,and can be analogized to different electronic components and solder materials.This method has a certain guidance in engineering applications.