Simulation Analysis And Experimental Study Of Ultrasonic Polishing Based On Monocrystalline Silicon

With the development of the national industry,industrial equipment is required high precision which depends on the final polishing technology largely,such as the final accuracy of important equipment of our country’s astronomy,military and aerospace industries,is almost entirely up to the polish.Therefore,the development of polishing technology directly determines a country’s processing,production of high-precision parts,equipment level in industrial.In addition,monocrystalline silicon has smaller coefficient of thermal expansion than metallic materials due to its inherent high thermal conductivity.Therefore,these hard and brittle non-metallic materials,like monocrystalline silicon,is widely used to manufacture optical components in glare optical system.Recently,monocrystalline silicon in military electronic devices is becoming more and more important.Therefore,the realization of high-quality surface polishing of monocrystalline silicon has profound implications for industry and defense in our country.In this paper,theoretical,simulation and experimental methods are used to study the effect of polishing parameters on the polishing efficiency and polishing quality.Combined with the finite element analysis and experimental verification,a method of finite element analysis is provided to optimize the polishing process.The main contents and innovative achievements of this article are as follows:(1)The dynamic theory of fluid was used to analyze the influence of ultrasonic parameters in the mathematical model on the flow field,and the possibility and behavior of pressure and velocity in ultrasonic flow field were proved.A mathematical model of single particle(spherical,octahedron)material removal is established,and the model formula used to deduce the impact of various parameters on the material removal.(2)The ultrasonic flow field simulation model is established,and the influence on the flow field of the model is observed by changing the ultrasonic parameters.Based on the model simulation data,the changing trend of the velocity and pressure on the flow field was deduced.(3)The impact simulation model was established.By changing the parameters of the particle size,shape,impact velocity and angle,the impact of the abrasive particles on the workpiece material removal and surface quality was analyzed in the process of impacting the workpiece.(4)Combining with the simulation results,the ultrasonic polishing experiment of single crystal silicon was carried out,which verified the correctness of the theoretical and finite element analysis.