The Modeling And Studying On Sawing Force Of Diamond Wire Saw Cutting SiC

With the continuous development of society,the hard brittle material is applied more and more extensively.The processing technology of this material becomes an important research and the cutting process directly affects the processing quality,cost and efficiency.In the method of cutting brittle materials,the technology of cutting with diamond wire saw is suitable for the materials such as silicon carbide and all kinds of precious stones since it has the following advantages like high quality of slice surface narrow kerf less pollution to the environment and difficult to pieces.This thesis focuses on the sawing force of cutting Si C with diamond wire saw,gains cutting force model and experimental model of cutting process,then optimizing process parameters that influence cutting force.Includes the following parts specifically :Slicing mechanism of diamond wire saw was studiedBe based on single abrasive indentation model,quantizing material removal rate in wire slicing Si C under assumption which the abrasives distribute evenly.This is base of follow-up study.The cutting model of cutting Si C with diamond wire saw is established.Treating the cutting depth of single cycle as variable,then acquire work piece radius,contact angle and contact length of whole cutting process by model simulation.The average percent absolute errors between the experimental and simulation data for radius,contact angle,contact length are 8.09%,9.53% and 10.04%,respectively.Combining with contact length model and cutting force model,calculating the cutting force in tangential and normal direction.Then,analysis the experimental data and predicted data to verificate the reliability of model.At last,cutting the rectangular glass which the contact length is constant.And combining cutting force model to predicate tangential and normal force.