Preparation Of Polystyrene/silver Composite Microspheres For Anisotropic Conductive Adhesives

With the continuous progress of modern electronic information technology in my country,highly integrated and multifunctional have gradually become the development trend of electronic components,and the emergence of mobile terminal equipment has posed a challenge to portability.Correspondingly,higher and higher requirements are put forward for the performance indicators of electronic materials.At this time,the introduction and application of conductive polymer materials has become a new solution,which can realize the connection and conduction of various electronic components.Meet the needs of portable and foldable electronic equipment.At present,in order to obtain a conductive polymer with good electrical conductivity and a larger contact area after hot pressing,composite materials composed of various particles(metals,polymers,etc.)in the polymer matrix have been developed,and polystyrene/Silver(PS/Ag)composite material is an ideal material for achieving better electrical conductivity and larger contact area after hot pressing,and has gradually become a research hotspot in the field of conductive polymers.In this paper,polystyrene microspheres are used as the core material,and silver particles are deposited on the surface of the microspheres by electroless plating to form a metal shell.Polystyrene(PS)/silver composite microspheres are prepared,and the different coarsening time,the effects of different sensitization times and times,activation processes,different reducing agents,and stirring methods on the preparation of electroless plating are characterized by laser particle size distribution detection,infrared spectrum analysis,scanning electron microscope scanning analysis,energy spectrum analysis,X-ray diffraction,etc.The research results obtained are as follows:(1)Surface modification of polystyrene microspheres by chemical roughening and grafting-SO3H groups are beneficial to the adsorption of Sn²⁺in the sensitization process.When the roughening solution is a mixed solution of dilute sulfuric acid and chromium trioxide,the surface of the microspheres can be modified after 4 hours of roughening treatment.(2)Through multiple sensitization and prolonging the sensitization time,the uniform adsorption of Sn2+on the surface of the modified microspheres can be promoted,which lays the foundation for the uniform deposition of Pd particles,and promotes the uniform coating of the silver shell on the surface of the polystyrene microspheres.At the same time,the Pd particles deposited during the activation process will serve as the catalytic center for the reduction of silver particles,which greatly improves the deposition of silver particles on the surface of the microspheres and is beneficial to the formation of silver shells.(3)By adjusting the mass ratio of polystyrene microspheres and silver nitrate,the deposition of silver particles on the surface of the microspheres can be promoted.When the mass ratio is 1:2,the coverage rate of the deposition of silver particles on the surface of the microspheres is high;In the process,when hydrazine hydrate is used as a reducing agent for electroless silver plating,it can better control the speed of nucleation and particle growth during electroless silver plating on the surface of polystyrene microspheres,which is beneficial to the uniform deposition of silver particles on the surface of the microspheres and promotes the surface The coating of the silver shell;the introduction of different stirring methods in the electroless silver plating process can promote the uniform coating of the silver shell on the surface of the microspheres.The method of ultrasonic-assisted electroless plating can better disperse polystyrene/silver composite microspheres.(4)Using polystyrene microspheres with multiple sensitization and silver plating treatments as a template,a polystyrene/silver composite with high surface silver particle coverage and good dispersion can be prepared under the method of ultrasonic-assisted electroless plating.Microspheres.