Studies On Synthesis And Properties Of Phenolic Imide Resin

The current era is the era of the Internet of Everything,and the construction of AI algorithms,big data,cloud computing,new energy,digital twins,Industry 4.0,national defense science and technology,aerospace and smart factories are inseparable from the innovation of semiconductor technology.The new generation of semiconductor technology places higher demands on the performance of traditional resin materials.Phenolic resin is a kind of low price,excellent electrical insulation,acid resistance,excellent ablation resistance,low smoke rate and self-extinguishing and intrinsic flame retardant polymer,in the field of electronic materials such as photoresist,electronic ink,copper clad laminate,packaging materials occupy a large market share;At the same time,it can be copolymerized and blended with benzoxazine resin,epoxy resin,bismaleimide resin and other fields.However,phenolic resin has the disadvantages of large odor of raw materials,small molecules released by curing,large curing shrinkage,and brittle solidification.Therefore,it is imperative to modify phenolic resin.Common modified phenolic resins are etherified or esterified phenolic hydroxyl groups or hydroxymethyl groups,such as boron-modified phenolic and silicone-modified phenolics,or the introduction of rigid aromatic ring structures such as biphenyl,naphthalene rings,etc.in the main chain,but the former loses a large number of hydroxyl active reaction sites due to the chemical modification of phenolic hydroxyl groups,and the latter is brittle due to strong molecular chain rigidity,which limits the excellent performance of phenolic resins.The aim is to prepare a new phenolic imide resin with phenol containing phenolimide ring in the polymer backbone and study the modified epoxy adhesive.The resin does not contain phenol,retains all the active site of the phenolic hydroxyl group,and adopts the addition curing mechanism to cure without the release of small molecules,which can perfectly solve the existing problems of the phenolic resin.For this purpose,this paper first synthesized N-(4-hydroxybenzene)maletonide acid(HPMA)with p-aminophenol and maleic anhydride,and then synthesized —— N-(4-hydroxyphenyl),and determined the synthesis process of oxalic acid and zinc acetate.Then,the HPMA-F resin was dehydrated and further synthesized into the new phenolic-imide resin ——N-(4-hydroxyphenyl)maleimide-formaldehyde(HPMI-F)resin and studied the thermal weight loss of the two resin curing materials.Then,HPMA-F resin and HPMI-F resin were modified components to prepare the new phenolic-amide acid-epoxy adhesive —— HPMA-F / epoxy adhesive and the new phenolic-imide-epoxy adhesive ——HPMI-F / epoxy adhesive.The study on the curing reaction kinetics and various properties of the adhesives shows that the curing reaction of the two adhesives is complex,and the curing reaction stage of the adhesives is 0.91;both have excellent dielectric properties,and the relative dielectric constant can reach 2.11 and 2.68 respectively;the change rate of apparent activation energy after 24 hours is within 5%,and the storage properties at room temperature is good.HPMI-F / epoxy adhesive is superior to HPMA-F / epoxy adhesive in both hydrophobicity and tensile shear strength,and has good development potential in semiconductor packaging,5G communication,new energy vehicles and other fields.