Research On Manufacturing Method And Application Experiment Of C/SiC Ceramic Based On Light-curing 3D Printing Technology

Light-curing 3D printing technology provides a solution to the difficult problems of SiC traditional methods for manufacturing high-precision and complex structures.However,the current SiC manufacturing method based on light-curing 3D printing still has bottlenecks such as many impurities,poor performance,and difficulty in slurry curing.This paper proposes a method of manufacturing SiC-based ceramic parts by using diamond and light-curing 3D printing technology.The preparation method of diamond light-curing slurry,light-curing forming process,and preparation process of SiC-based ceramic materials are studied.The mechanical and thermal properties of C/SiC ceramics have been studied,and applied experimental researches on fasteners,electronic packaging and heat sink components have been carried out.The research and development scheme of special diamond paste for light-curing 3D printing was put forward.By constructing the theoretical model of diamond body and measuring method of reaction coefficient,the components and preparation process parameters of diamond slurries were determined.The rheological properties of the slurry and the light-curing printing process were measured and analyzed.The optimized process parameters of the lightcuring printing were determined,which effectively improved the printing efficiency and provided a new solution for the light-curing 3D printing of SiC ceramics.The preparation method of SiC with the combination of high temperature pyrolysis carbonization and reaction sintering of light-curing printing diamond model was studied.The pyrolysis process of carbon body and reaction sintering process of C/SiC ceramics were established through experiments.It was found that the carbon body had good siliconizing ability.The relative density and bending strength of C/SiC ceramics are higher than that of most SiC matrix composites based on additive manufacturing technology,which are 93% and460 MPa,respectively.The thermal conductivity of C/SiC ceramics can reach 245 W·（m·K）^-1,and the thermal conductivity of C/SiC ceramics can be controlled by the experimental study of special-shaped fins and 3D encapsulated parts.Through the performance test of the special-shaped fin with periodic continuous surface structure,it was found that its theoretical heat dissipation capacity is better than that of the traditional fin fin.The feasibility of photocurable 3D-printed C/SiC ceramics for electronic packaging was verified by testing the 3D packaging parts with 3D circuit structure.The research provides a new manufacturing method for electronic products with high efficiency and heat dissipation.