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Keyword [Anand model]
Result: 1 - 4 | Page: 1 of 1
1.
Constitutive Description Of Temperature And Strain Rate Dependent Tensile Behaviors Of Solder
2.
Experimental Research On Solder's High Temperature Mechanical Property And Thermal Cycle Numeric Simulation Of Solder Joints In Electronic Package
3.
Experimental Determination Of Anand Constitutive Model Parameters For Micro-Electronics Lead-Free Material SnAgCu And Solder Joint Life Prediction
4.
Mechanical Properties And Fatigue Damage Studies On SnAgCu Lead-free Solder
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