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Keyword [BGA solder joint]
Result: 1 - 10 | Page: 1 of 1
1.
Study On Mechanical Properties And Size Effects Of Lead-Free BGA Solder Joint By Nanoindentation
2.
Failure Analysis Of Lead-free Solder Joints Under Temperature-vibration Coupling
3.
Ball Grid Array Package Solder Joint Failure Analysis, And Thermal Stress Simulation,
4.
Interfacial Reaction Between Electroless NiPdAu Surface Finish And SnAgCu Solder And BGA Solder Joint Reliability
5.
Thermal Shock Resistance And IMC Behavior Of Low-Ag Lead-Free Solder Micro-Joints
6.
Study On Nanomechanical Properties Of SAC0307-x La BGA Solder Joint Under Cyclic Shear Loading
7.
Modeling of Failure Mechanism and Life Prediction of Lead-Free BGA Solder Joint under Repetitive Mechanical Drop Loading
8.
Study On Mechanical Properties And Fracture Behavior As Well As Their Size Effects Of Micro-scale BGA Structure Solder Joints Under Coupled Electro-mechanical Loads
9.
Research On BGA Solder Joint Fault Diagnostics And Traceability Approach Based On Multi-model Fusion
10.
Reasearch On Contactless Testing Of BGA Solder Joints Fault Based On Crosstalk Coupling
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