Font Size: a A A
Keyword [Copper Deposition]
Result: 1 - 20 | Page: 1 of 2
1. Electrochemical Surface Processes Investigated By Using In Situ Vibrational Spectroscopies And Scanning Tunneling Microscope
2. Surface Functionalization And Electroless Copper Deposition Of The Fluoropolymer Films
3. Surface Structure Of Cu/ZnO Catalyst And Its Activation To Hydrogen Molecule
4. Surface Modification On Poly(Ethylene Terephthalate) Fabric And The Study On Electroless Deposition Process
5. Laser-induced Electroless Copper Deposition On Modified Plastic Surface
6. Preparation And Properties Investigation Of Conductive Celloluse Fabric
7. Study Of Textile-based, Wearable And Flexible Microstrip Antenna Using Directly Printing Technique
8. Graft-Modification Of Polytetrafluoroethylene(PTFE) By Low Temperature Plasma And Electroless Copper Deposition Without Pd
9. Effect Of Aluminum-nickel On The Dynamic Behavior Of Anode And Cathode In Copper Alloy Electrolysis
10. Research On Surface Modification Of Flexible Substrates To Trigger Copper Deposition And Its Application In Flexible Electronics
11. Novel Signal Amplification Strategies For High-performance Immunochromatographic Test Strips
12. Investigation Of Smooth Copper Deposition With Additive Regulation For Printed Circuit
13. Preparation And Microstructure Of Zn-Cu Alloy Coating On Low Carbon Steel Surface
14. Copper And Nickel Electrodeposited Electrochromic Devices Based On Eutectic Solvents
15. Optimization And Performance Study Of In-situ Synthesized Three-dimensional Network Graphene/copper Composites
16. Electroless Copper Deposition: A Sustainable Approach
17. Pulsed laser deposition and thin film properties of p-type barium copper sulfur fluoride, barium copper selenium fluoride, barium copper tellurium fluoride and n-type zinc indium oxide wide band-gap semiconductors
18. Dynamics and mechanism of copper deposition onto silicon by galvanic displacement
19. Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers
20. Passivation effects of surface iodine layer on tantalum for electroless copper deposition
  <<First  <Prev  Next>  Last>>  Jump to