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Keyword [Copper interconnect]
Result: 1 - 10 | Page: 1 of 1
1.
The Effect Of Metal Substrates On The Oxidation Reliability Of Electrodeposited Copper Interconnect Layers
2.
Investigation Of Electrochemical Mechanism About The Additives In Copper Interconnect
3.
Study On Plasma Enhanced Atomic Layer Deposition In The Thin Film Deposition Of Copper Interconnect
4.
Research On RMoB(R=Ni,Co) Diffusion Barrier Thin Film Micro-nanoscale ULSI-Cu Metallization
5.
Cu Interconnect Dual Damascene Etch Process Development And Optimization Based On Metal Hard Mask Integration Approach
6.
Process evaluation and characterization of tungsten nitride as a diffusion barrier for copper interconnect technology
7.
Multilevel Dual Damascene copper interconnections
8.
Preparation And Thermal Stability Study Of Carboxyl Chemically Modified APTMS Self-assembled Monolayer Diffusion Barrier
9.
Study On Copper Interconnect And Tantalum Barrier CMP And Electrochemical Corrosion Characteristics
10.
Research On Low Roughness Of GLSI Multiayer Copper Interconnect Barrier
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