Cu substrate - Globe Thesis

Keyword [Cu substrate] Result: 1 - 16 \| Page: 1 of 1
1.	Interfacial Reactions Of Sn-8Zn-3Bi-X And Sn-3.5Ag-xZn Lead-free Solder And Cu Substrate
2.	Influence Of High Magnetic Field On Liquid-Solid Interfacial Reaction Between SnZn Based Alloy And Cu Substrate
3.	Preparation Of Inn Epitaxy Films On Cu Substrates
4.	Study On The Equipment And Technics Of Coating Ni/Cr Multiplayers On Cu Substrate
5.	Failure Mechanism Of The Interface Between Ball Grid Array Solder And Cu Substrate Induced By Thermal/Current/Vibration Loading
6.	Soldering Performance And Interfacial Reliability Between Lead-free Solder And Ni-based Composite Coating On Cu Substrate
7.	Research On Laser High Entropy Alloying On The Surface Of Single-element Cu Base Alloy
8.	Investigation Of The Wettability And Interfacial Reactions Between Sn-0.7Cu (-0.5Ni) Solder And Cu Substrate With Thermoelectric Coupling Field
9.	Study On The Equipment And Technics Of Coating Ni/cr Multiplayers On Cu Substrate
10.	Interfacial Reaction And Electromigration Of SnZnBi-χNi Lead-free Solders And Cu Substrate
11.	The Study Of Preparation And Anti-corrosion Performance Of Nickel-base Multielement Alloy Coatings On Cu Substrate
12.	The Preparation Of Aluminum In Ionic Liquid And Its Electrochemical Nucleation Mechanism
13.	The Experiment Research And Theory Analysis Of The Effect Of Element On Properities Of Intermetalic Compound Between Sn-based Solder And Cu Substrate
14.	Study Of Hot-pressing Welding Process And Solder Joint Microstructure Of SAC305 Solder/Cu Substrate
15.	Effect Of Zn Addition In Cu Substrate On Interfacial Reactions During Soldering
16.	Study On The Process And Performance Of Pb5Sn2.5Ag-Cu Composite Solder At Cu Substrate
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