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Keyword [Cu3sn]
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1. Laser-induced Transfer Of Cu-sn Single Imc Film And Interfacial Behavior Among IMC Copper And TIN Film
2. Preparation Of Ternary And Penta-I2-Ⅱ-Ⅳ-Ⅵ4 Cu-based Nanocrystals And Their Related Photoelectric Properties
3. Characterization and Modeling of the Failure Mechanism of Copper-Tin (Cu-Sn) Intermetallic Compounds in Lead-free Solder Joints
4. Microstructure Evolution Mechanism And The Performance Characterization Of Cu/Cu3Sn-Cu/Cu Composite Micro-joints
5. Study On The Dissolution Of Substrate And IMC Growth In The Interfacial Reaction Of Cu/Ga And Cu-Sn/Ga
6. Microstructure And Mechanical Properties Of Cu3Sn-Cu Composite Micro-joints Based On Three Bonding Methods
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