Keyword [Epoxy Molding Compound] Result: 1 - 9 | Page: 1 of 1 1.  The Preparation Of O-cresol Formaldehyde Epoxy Resin In Epoxy Molding Compound Field 2.  Investigation On The Storage Stability And Hybrid Material Of Epoxy And Phenolic Resins 3.  Research And Development Of High Performance Epoxy Molding Compounds 4.  Preparation And Performance Optimization Of Epoxy Molding Compound For Electronical Packaging 5.  Preparation Of High Thermal Conductivity And Insulation Epoxy Molding Compound 6.  Perhydropolysilazane Derived Sion Interfacial Layer For Electronic Encapsulation 7.  Research And Development Of New High-purity Microelectronic Packaging Materials 8.  Study On Synthesis And Application Of Imidazole-type Latent Curing Accelerator For Epoxy Resins 9.  Formulation Design And Mechanism Study Of Interface Enhanced Anti-delamination Epoxy Molding Compound   <<First  <Prev  Next>  Last>>  Jump to

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