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Keyword [IMCs]
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1. Separation And Controlling Of Intermetallic Compounds In Lead-free Sn-Ag Solders
2. Interfacial Evolution And Reliability Of Lead-Free Solder Joints For Electronic Packaging
3. Microstructural Formation Of Sn-Ag-Zn Solder And Its Jointed Interfaces
4. First-principles Calculation For Improving Ductility Of Aluminides By Alloying Elements At Room Temperature
5. Influences Of Minor Elements Addition On The Interfacial Reactions Between Lead-free Solders And Common Substrates
6. In-situ SEM/TEM Tensile Testing Of Microsoldered Joint And Ceystal Orientation Of Sn-Cu Imcs
7. Grain Orientations And Anisotropic Properties Of Cu-Sn IMCs In Micro-Interconnection Solder Joints
8. Influences Of Rare Earth Additions On The Microstructure And Interfacial Reaction Of SnBi Solder Alloys
9. Effect Of Dimensional Change And Micro-Mechanical Characteristics Of Cu-Sn Interconnects
10. The Basic Research Of Rapidly-solidified Lead-free Solders
11. The Wettability Of SAC305Solder And Growth Mechanism Of Intermetallic Compounds Under Thermal Stress As Well As Electric Field
12. Interfacial Reaction Between Tin-based Solders And Polycrystalline Copper Pad
13. Microstructural Evolution And Mechanical Characteristics Of Full Intermetallics Structured Cu/Sn/Cu(Ni) Microjoints
14. Study On Wetting Kinetics Of Typical Brazing/soldering System And Interfacial Microstructure Of Mirco-interconnections Joint
15. The Processes And Mechanism For The Enhancement Of Laser-welded Joint Strength Of Dissimilar Ti6Al4V-304 Stainless Steel
16. Fabrication Of High Temperature Solder Based On Cu@Sn Core Shell Structured Powder And The Study Of Cu-Sn IMCs Growth On Curved Surface
17. Investigation On The Microstructure,IMCs Morphology And Reliability Of Sn-58Bi-xMo Solder Joints
18. Research On Interfacial Behaviors Of Al/Ni/Cu Composites
19. Study On The Microalloying And Interface Microstructure Of Sn-0.7Cu Lead-Free Solder
20. The Study On Aluminum/steel Interface Layer Based On Synchrotron Radiation
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