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Keyword [Interfacial]
Result: 61 - 80 | Page: 4 of 10
61. Research And Development Of Monolayer Brazed CBN Wheels For High Efficiency Grinding Nickel-based Superalloy
62. The Self-assembly Of Air-water Interfacial Oxide Films
63. Study On Poly (Phthalazinone Ether Sulfone Ketone)s Ultrafiltration Membranes And Their Composite Membranes
64. Wetting Dynamics Of Solders In SMT
65. Study On The Preparation Of Imidazoline Surfactants-Modified Nanomaterials And Tribological Properties Of The Related Materials
66. Study On The Interfacial Diffusion Behaviors Of SiC Continuous Fiber Reinforced Ti-Matrix Composites
67. The Structure Of Polymer Blends At Quiescence And Under Shear Flow With Or Without The Influence Of External Surfaces
68. Characterization And Tribological Properties Of Self-Assembled 3-Aminopropyltriethoxysilane-Rare Earth Composite Films
69. Study On The Anisotropic Interfacial Properties, Morphology Evolution And Rheological Behavior Of Liquid Crystal/flexible Polymer Immiscible Blend
70. Aging Of Surface Properties Of High Performance Fibers Treated With Atmospheric Pressure Plasma
71. Study Of PPESK Hollow Fiber Composite Nanofiltration Membrane And Fundamental Application
72. Synthesis And Properties Of Novel Polyesters From Derivatives Of Levulinic Acid
73. Effect Of Reactive Compatibilization On The Morphology And Physical Properties Of Nylon 6/Acrylonitrile-Butadiene-Styrene Blends
74. A Study Of The Relationship Between Surfactant Structures And Interfacial Dilational Properties In EOR
75. Studies On Preparation, Microstructures And Properties Of The SiC_p/Al Composites
76. Modification Of Various Surfactants And Polymers On The Stability Of O/W Emulsions
77. Microstructure And Properties Of Aluminum Matrix Composites Reinforced By Copper-Coated Al18B4O33 Whiskers
78. The Interfacial Reaction Law And Micromechanism Between Titanium Alloy Melts And Ceramic Mould
79. Interfacial Reaction And Hot Deformation Behaviours Of Bi2O3-Coated Aluminum Borate Whisker-Reinforced Aluminum Matrix Composite
80. Interfacial Evolution And Reliability Of Lead-Free Solder Joints For Electronic Packaging
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