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Keyword [Intermetallic Compounds (IMCs)]
Result: 1 - 11 | Page: 1 of 1
1.
Separation And Controlling Of Intermetallic Compounds In Lead-free Sn-Ag Solders
2.
Interfacial Evolution And Reliability Of Lead-Free Solder Joints For Electronic Packaging
3.
Microstructural Formation Of Sn-Ag-Zn Solder And Its Jointed Interfaces
4.
Influences Of Minor Elements Addition On The Interfacial Reactions Between Lead-free Solders And Common Substrates
5.
Influences Of Rare Earth Additions On The Microstructure And Interfacial Reaction Of SnBi Solder Alloys
6.
The Wettability Of SAC305Solder And Growth Mechanism Of Intermetallic Compounds Under Thermal Stress As Well As Electric Field
7.
Interfacial Reaction Between Tin-based Solders And Polycrystalline Copper Pad
8.
Study On Wetting Kinetics Of Typical Brazing/soldering System And Interfacial Microstructure Of Mirco-interconnections Joint
9.
The Study On Aluminum/steel Interface Layer Based On Synchrotron Radiation
10.
Effect Of Polycrystalline Cu Microstructures On Sn/Cu Soldering Interfacial Reaction
11.
Effects Of Substrate Roughness And Barrier Layer On Wetting And Spreading Behavior Of Sn-35Bi-1Ag Solder
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