Intermetallic compound(IMC) - Globe Thesis

Keyword [Intermetallic compound(IMC)] Result: 1 - 16 \| Page: 1 of 1
1.	Influence Of High Magnetic Field On The Growth Behavior Of Intermetallic Compound Layers At Sn-Cu Interface
2.	Effect Of Alloy Element Addtion On IMC At The Soldering Interface Of Sn-based Binary Solders
3.	An Investigation Of Dissimilar Metal Laser Welding Between Magnesium And Alluminium Alloys
4.	The Preliminary Study Of A New Lead-free Interconnection Method Based On Electromagnetic Stirring
5.	Interfacial Reactions Between Single Crystal Cu (Ni) Substrates And Lead-free Solders
6.	Effect Of Solder Volume On Interfacial Reactions Between Lead-free Solder Balls And Different Pads
7.	Study Of The Preparation And Application Reliability Of Fe₃O₄Nano-composite Solder
8.	Research On The Electromigration Phenomena Of Lead-Free Solder And Intermetallic Cu₆Sn₅ Phase In Lap Solder Joints
9.	The Effects Of Soldering Temperature And Cooling Rate On Interfacial Microstructure In Lead-free Soldering
10.	Research On The Fabrication And Reliability Of Alloy Bumps Based On Multilayer Electroplating
11.	Study Of Intermetallic Compounds Growth Behavior And The Effects Of Mn Addition On Properties Of SnAgCu Solder
12.	Thermal Reliability Of Low-silver Lead Free Ball Grid Array (BGA) Solder Joints
13.	The Study On The Interface Of General Aluminum/steel Layer-metal Composites With Si And Er Micro Alloying In General Aluminum
14.	Research On Interfacial Reactions Between Sn And Electrodeposited Nanocrystalline Copper
15.	Numerical Simulation Of Dissimilar Al-Steel Resistance Spot Welding And Studies On Its Interfacial Behavior
16.	Polarity effect of electromigration on intermetallic compound (IMC) formation in lead-free solder V-groove samples
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