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Keyword [Lead-free solder]
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1. Development Of Lead Free Solder And Its Interfacial Issues In Electronics Packaging
2. A Study Of Sn-9Zn Lead-free Electronic Solder And Its Improvement By Alloying
3. Separation And Controlling Of Intermetallic Compounds In Lead-free Sn-Ag Solders
4. Study On The Microstructure,Properties And Interfacial Reaction Of Sn Based Lead-free Solder
5. Investigation On Low Temperature Sn-Zn Base Lead-Free Solder Alloys
6. A Study On Hypoeutectic Sn-Zn Alloys As Lead-free Solders
7. Study On Damage Constitutive Model And Failure Mechanism Of Lead-Free Solder In Microelectronic Packaging
8. Wetting Dynamics Of Solders In SMT
9. Interfacial Evolution And Reliability Of Lead-Free Solder Joints For Electronic Packaging
10. Multiaxial Ratcheting Deformation And Low Cycle Fatigue Of Lead-free Solder Sn-3.5Ag
11. Research On The Liquid Structure Of Lead-free Solders And The Interfacial Reaction During Soldering And Their Correlation
12. The Development Of Tin Based Composite Lead-free Solders
13. Reliability Study On A Sn-Ag-Cu Lead Free Solder Reinforced With Ni Coated Carbon Nanotubes
14. Fundamental Research On The Melting Temperature Depression Of The Sn-based Lead-free Solder Alloy Via Size Effect Of Nanopaticles
15. Study On Effects Of Ce On Properties Of Sn-Ag-Cu & Sn-Cu-Ni Solders And Reliability Of Soldered Joints
16. Diode Laser Soldering To Electronic Mounting Components/Devices With Lead-free Solder
17. Electrical Measure Theory And Application Of Thermal Damage Of Lead Free Solder Joints
18. Micro-Mechanical Behavior Of Sn-Ag-Cu/Cu Solder Joints Consisting Of Numerable Crystal Grains
19. Investigation On Reliability Evaluation Of SnAgCu Based Lead Free Soldered Joints Under Drop And Impact Loading Conditions
20. Interfacial Reactions Of Sn-8Zn-3Bi-X And Sn-3.5Ag-xZn Lead-free Solder And Cu Substrate
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