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Keyword [Micro solder joint]
Result: 1 - 13 | Page: 1 of 1
1.
In-situ SEM/TEM Tensile Testing Of Microsoldered Joint And Ceystal Orientation Of Sn-Cu Imcs
2.
Research On Microstructure Evolution Of Micro-solder Joint Induced By Temperature Gradient
3.
Failure Performance And Mechanism Of Board-level Sn-Ag-Cu/Cu Solder Interconnects Under The Coupling Of Multifields Loading
4.
Study Of Geometrical Size Effect On Interfacial Diffusion Kinetics Of Cu/SAC305/Cu Micro Soldered Joints
5.
Study On Interfacial Reaction And Mechanical Properties Of Lead-free Solder Joints Under Miniaturization
6.
Liquid-solid Interfacial Reactions In Fine Pitch Cu/Sn-3.0Ag-0.5Cu/Ni Solder Interconnects
7.
In-situ Plasticity And Creep Behavior Of Cu/SAC/Cu Micro Solder Joints Under Variable Temperature
8.
Microstructure Evolution And In-situ Mechanical Property Of Cu-Sn Compounds In Micro Solder Joint
9.
Research On Micro-structure And Creep Of Solder Joint Under Thermomigration
10.
Study On Microstructure And Orientation Of Micro-solder Joint Under Thermomigration
11.
Research On Micro-structure And Shear Behavior Of Low Temperature Packaging Micro Solder-Joint Under Thermomigration
12.
Thermomigration In Cu/In-48Sn/Cu Micro Solder Joints And Its Effect On Soldering Interfacial Reactions
13.
Effect Of Cu/Sn Content On The Properties Of IMC-Cu Composite Micro Solder Joints
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