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Keyword [Microelectromechanical systems]
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1. Three-dimensional Microfabrication On GaAs By Using Regular Patterns Molds By The Confined Etchant Layer Technique
2. Scratch Damage Behavior Of Monocrystalline Silicon And Nickel-Titanium Shape Memory Alloy
3. Integrated Ag/AgCl Reference Electrode Multi-parameter Sensor For Water Quality Monitoring
4. High throughput, on-chip, in situ investgations of structural properties of polycrystalline silicon for microelectromechanical systems
5. Application of alkylsilane self-assembled monolayers for cell patterning and development of biological microelectromechanical systems
6. Polymer microelectromechanical systems: Fabrication and applications in biology and biological force measurements
7. Growth and characterization of nanocrystalline diamond films for microelectronics and microelectromechanical systems
8. Vapor phase lubrication of microelectromechanical systems (MEMS) for space applications
9. Experimental Studies of the Tribological Behavior of Microelectromechanical Systems
10. Bulk titanium microelectromechanical systems
11. Electrosynthesized nanocomposites for microelectromechanical systems
12. Layer-by-layer nanoassembly combined with microfabrication techniques for microelectronics and microelectromechanical systems
13. Inkjet printed gold nanoparticle films for microelectromechanical systems
14. Packaging of two-dimensional microelectromechanical systems (MEMS) variable capacitors with liquid crystal polymer
15. Temperature-dependent mechanical behavior of silicon dioxide, gold and gold-vanadium thin films for VLSI integrated circuits and MicroElectroMechanical systems (MEMs)
16. Simulation and synthesis of MicroElectroMechanical systems
17. Characterization of residual stress in microelectromechanical systems (MEMS) devices using Raman spectroscopy
18. Surface modification and characterization of PMMA used in the construction of microelectromechanical systems
19. Sputter deposition and characterization of thin film nickel titanium shape memory alloy for microelectromechanical systems application
20. Investigation of Adhesion Layer for Hybrid Metal and Glassy-Carbon (GC) Microelectromechanical Systems (MEMS)
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