Microelectronic packaging - Globe Thesis

Keyword [Microelectronic packaging] Result: 1 - 16 \| Page: 1 of 1
1.	Investigation Of Characteristics For Adhesive And Bonding Reliability For COG Assembly Under Hygrothermal Conditions
2.	Study On Damage Constitutive Model And Failure Mechanism Of Lead-Free Solder In Microelectronic Packaging
3.	Study On The Metallurgical Behavior Of Bond Interface In Ultrasonic Wedge Bonding
4.	A Study Of Bonding Reliability For Silver-epoxy Adhesive
5.	Study On Electroless Ni-P Film Plating In Microelectronic Packaging
6.	Study On Interfacial Reactions In Ni/Sn-xZn/Ni And Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration
7.	Research On Cu Based Nanosolders For Low Temperature Cu-cu Bonding
8.	Chemical Synthesis And Application Explorations Of Iron-Based Magnetic Nanomaterials In Microelectronic Packaging
9.	Controllable Preparation And Low Temperature Sintering Of Nano Silver/Copper And Its Interconnection Application In Microelectronic Packaging
10.	Research On Reliability Of Microelectronic Packaging Solder Joints Under Electric Load
11.	Computational and experimental investigations of laser drilling and welding for microelectronic packaging
12.	Carbon nanotubes for thermal interface materials in microelectronic packaging
13.	Selection and use of silane adhesion promoters in microelectronic packaging
14.	Materials research on metallized aluminum-nitride for microelectronic packaging
15.	Research And Development Of New High-purity Microelectronic Packaging Materials
16.	Controlled Synthesis Of Copper-based Micro/nano Materials And Its Application In Microelectronic Packaging
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