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Keyword [Packaging]
Result: 1 - 20 | Page: 1 of 10
1. 1.Molecular Dynamics Simulation For The Vibration Characteristics Of Nonlinear Optical Material BBO 2.Reliability Research On Flip Chip Electronic Packaging
2. Preparation And Investigation On The Polyimide/AIN Composite Materials
3. Development Of Lead Free Solder And Its Interfacial Issues In Electronics Packaging
4. Research On The Key Technologies Of Target Tracking And Defect Detection For Pharmaceutical Packaging Inspection
5. Study On Postharvest Physiology And Preserving-freshness Of Fresh Vegetable Under The Condition Of Simulated Cold Stroage Of Warship
6. Transient Contact Liquid-Solid Reaction Of Solder Droplet/Pad And Interfacial Microstructure Evolution
7. Preparation Of SiCp/Al Composites And Electronic Device Fabrication
8. Investigation Of Characteristics For Adhesive And Bonding Reliability For COG Assembly Under Hygrothermal Conditions
9. Study On Extending The Shelf-life Of Green Asparagus And Peach Fruit
10. Microstructure And Properties Of SiCp/Cu Composites For Electronic Packaging
11. Study On Damage Constitutive Model And Failure Mechanism Of Lead-Free Solder In Microelectronic Packaging
12. Study On Preparation, Properties And Mechanism Of Low-Temperature Co-fired Glass Ceramic Materials
13. The Study On The System Of "Green" Furniture Packaging
14. Wetting Dynamics Of Solders In SMT
15. Studies On The Quality Changes Of Huanghua Pears During Transport And Storage
16. Study On Plasticizer Di-2-Ethylhexyl Phthalate Migration From Food Grade PVC Film
17. Basic Research On The Application Of Cyclodextrins In Antimicrobial Food Packaging
18. Interfacial Evolution And Reliability Of Lead-Free Solder Joints For Electronic Packaging
19. Study On Conducting Polypyrrole Films For Electromagnetic Interference Shielding
20. Study On The Preparation And Properties Of Electronic Packaging Composite Materials With Controllable Thermal Expansion Coefficient
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