Planarization - Globe Thesis

Keyword [Planarization] Result: 21 - 40 \| Page: 2 of 5
21.	Surface form memory by indentation-planarization training of nickel titanium shape memory alloys
22.	Multi-functional composite materials for catalysis and chemical mechanical planarization
23.	Modeling and control of material removal and defectivity in chemical mechanical planarization
24.	Characterization and analysis on chemical and mechanical interactions during chemical mechanical planarization (CMP) of copper
25.	Electrochemical mechanical planarization (ECMP) of copper
26.	Copper surface chemistry relevant to chemical mechanical planarization (CMP)
27.	Fundamental consumables characterization of advanced dielectric and metal chemical mechanical planarization processes
28.	Chemical systems for electrochemical mechanical planarization of copper and tantalum films
29.	Characterization and modeling of mainstream and alternative conditioning and polishing technologies in inter-layer dielectric and copper chemical mechanical planarization
30.	Chemical mechanical planarization of copper thin films
31.	Application of fine particles in chemical mechanical planarization and in phosphors
32.	Effect of slurry chemicals on chemical-mechanical planarization of copper
33.	Oxalic acid based chemical systems for electrochemical mechanical planarization of copper
34.	Novel separation methods for removing nanoparticles and copper from chemical mechanical planarization wastes
35.	Tribochemical investigation of microelectronic materials
36.	Evaluation and modeling of alternative copper and inter-layer dielectric chemical mechanical planarization technologies
37.	Investigation of the chemical and electrochemical phenomena in the chemical mechanical planarization of copper
38.	Tribological, kinetic and thermal characteristics of copper chemical mechanical planarization
39.	Physicochemical Modeling of Copper Chemical Mechanical Planarization (CMP) Considering Synergies in Removal Materials
40.	Tribological, thermal and kinetic characterization of dielectric and metal chemical mechanical planarization processes
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