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Keyword [SAC305]
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1. Size Effect On Tensile Properties Of Cu/Sn-9Zn(SAC305)/Cu Solder Interconnects Under Aging And Current Stressing
2. An Investigation Of Creep Behavior Of SAC305Solder Bumps In Ball Grid Array
3. Study Of Geometrical Size Effect On Interfacial Diffusion Kinetics Of Cu/SAC305/Cu Micro Soldered Joints
4. Study Of The Microstructure And Mechanical Properties Of SAC305-nano Cu Composite Solder Paste
5. Effect Of Interface Reaction And Reliability Of Green Lead-free Solder SnAgCu
6. Study On Microstructure And Property Of Nano-silver Paste Joint Of Power IGBT And DBC By Low-temperature Sintering
7. Study On Liquid-solid Electromigration Behavior And Mechanism Of Sn-3.0Ag-0.5Cu Lead-free Solder Bumps In High Power Devices
8. Research On Basic Properties,Electro-and Thermo-migration Performance Of SAC305-X Composite Solders
9. Study On Electrochemical Migration Behavior Of SnAgCu Solder Alloy Under Thin Electrolyte Film And Controlling Of Corrosion Resistance
10. Study On Ultrasonic-Assisted Soldering Copper Plate With Tin-Based Lead-Free Solder
11. Study Of Hot-pressing Welding Process And Solder Joint Microstructure Of SAC305 Solder/Cu Substrate
12. Microstructure And Properties Of CuCGA Solder Column Interconnection Under New Column Planting Method
13. Study On The Interfacial Evolution Of SAC305 Micro Solder Joints Based On The Diffusion Of Graphene Barrier Layer
14. Rapid Thermal Fatigue Of SAC305 Lead-free Solder And Solder Bump
15. Study On Microstructure And Mechanical Properties Of Interconnection Between SAC305 Solder And Cu Column
16. Effect of aging on the transformation of phases in solder joint of PBGA packaging
17. Evolution of the microstructure and viscoplastic behavior of microscale SAC305 solder joints as a function of mechanical fatigue damage
18. Harmonic vibration testing of electronic components attached to printed wiring boards with SAC305 and eutectic tin-lead solder
19. Crystal plasticity finite element analysis of deformation behaviour in SAC305 solder joint
20. Study On Microstructure And Mechanical Property Of Cu-foam Reinforced Sn3.0Ag0.5Cu Solder Joints Under Ultrasonic Vibration
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