Sn-based Solder - Globe Thesis

Keyword [Sn-based Solder] Result: 1 - 20 \| Page: 1 of 2
1.	(The Investigation Of Phase Diagrams Of Sm-TM Systems And Sn Based Solder Systems)
2.	Researh On Interface Structure And Mechanical Properties Of Joints Of Soldering Pure Al And Al-mn Alloy With Sn Based Solders
3.	Studies On The Effects Of Zn On Interface Structure And The Corrosion Resistance Of The Sn/Al
4.	Sn-Based Solder Joints Property And Life Prediction In Extremely Low Temperature
5.	Interfacial Reactions Among Sn-based Solders And Substrates
6.	Spreading And Wetting Behavior And Interface Bonding Of Sn On Al Under Ultrasound
7.	A First Principle Calculation Of Al Based And Sn Based Solder With SiC Ceramic Interfacial Bonding
8.	Research On Corrosion And Leaching Behavior Of Sn-based Solder In Soil Environment
9.	Composition Origin Of Metallic Glasses And Solid Solution Alloys:Short-range-order Structural Unit
10.	Study On The Rapid Growth Behavior And Suppressing Method Of Sn Whiskers In Sn-based Solder Alloys
11.	The Experiment Research And Theory Analysis Of The Effect Of Element On Properities Of Intermetalic Compound Between Sn-based Solder And Cu Substrate
12.	Study On Brittle Fracture Mechanism Of Sn-based Solder Alloys At Low Temperature
13.	Study On Surface Modification Technology Of Aluminum Alloy Based On Ultrasonic
14.	Interface Structure Design And Bonding Characteristic Research Of Soldered Al Alloy And Sn-based Solders
15.	Study On Mechanism And Kinetics Of Interfacial Reactions In Sn-based Solder Joints During Multiple Reflows
16.	Microstructure Evolution And Failure Mechanism Of Sn-based Solder Joints In Extreme Temperature Environment
17.	Investigation On Interfacial Microstructure And Properties Of Sn-based Solder/Aluminum Alloy
18.	Investigation On Sn-based Solder Alloys For Soldering 1060 Aluminum
19.	The Study On Microstructure And Property Of Al₂O₃ Joints Using Foam Ni Reinforce Sn Based Solder With The Assistance Of Ultrasound
20.	Preparation Process And Properties Characterization Of High-Temerature Resistant Interconnection Material Based On Porous Cu Infiltrated With Sn-Based Solder
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