Font Size:
a
A
A
Keyword [Solders]
Result: 121 - 131 | Page: 7 of 7
121.
Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging
122.
Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders
123.
The influence of cold work on the wettability of lead-free solders on copper
124.
Wetting studies of lead-free solders on lead-free PWB finishes
125.
Reliability of lead-free solders in electronic packaging technology
126.
Studies on lead-free solders reinforced with mechanically-incorporated copper, silver, and nickel particles
127.
Disturbed state constitutive modeling and testing of solders in electronic packaging
128.
An analysis of global and localized creep strains and creep properties of non-composite lead-free solders at room and elevated temperatures
129.
An investigation of aging kinetics and creep deformation in composite solders with in situ particulate reinforcements
130.
Impression creep in near eutectic tin-lead and tin-silver solders
131.
The interaction of creep and fatigue in lead-tin solders
<<First
<Prev
Next>
Last>>
Jump to
