Subsurface damage - Globe Thesis

Keyword [Subsurface damage] Result: 41 - 60 \| Page: 3 of 6
41.	Investigation Into Ultra-Precision Machining Induced Subsurface Damage In Nanocrystalline Materials
42.	Study On Ultra Precision Machining Mechanism Of Monocrystalline Silicon Based On Molecular Dynamics
43.	Research On Surface/Subsurface Damage Of Glass-Ceramics Induced By Ultra-precision Grinding
44.	Research Of Magnetorheological Planarization Technology Based On Linear Oscillation
45.	Study On Ultrasonic Assisted Grinding Of RB-SiC And Residual Strength
46.	Research On CMP Mechanism And Process For Monocrystalline Germanium Wafers With Ice-fixed Abrasive Polishing Pad
47.	Research On Subsurface Damage Mechanism Of GCr15 Contact Fatigue
48.	Study On Single Crystal Diamond Processing With Sol-gel Polishing Film
49.	Research On Subsurface Damages In Ultrasonic Assisted Grinding Of BK7 Optical Glass
50.	Research On Subsurface Damage Of Hard And Brittle Materials By Discrete Element Method In Lapping
51.	Research On Precision Grinding And Measurement Technique For Low Subsurface Damage Of Monocrystalline Silicon Curved Optics
52.	Study On Grinding Force And Subsurface Damage In Single Abrasive Particle Grinding Process By Theoretical Analysis And Simulation
53.	Study On The Cutting Technology Of Endless Diamond Wire Saw
54.	Damage Detection And Technology Research On Surface/Subsurface Layer Of Ultra-thin And Large Size Stainless Steel Sheet Flexible Substrate
55.	Lapping And Polishing Mechanism Of Magnesium Aluminate Spinel Doom Cover By Fixed Abrasive
56.	Mechanism And Process Research Of Lithium Niobate Lapping And Polishing By Fixed Abrasive Pad With A High Efficiency And Low Damage
57.	Research On Grinding Damage Formation Mechanism And Suppression Technology Of Reaction Bonded Silicon Carbide Ceramics
58.	Research On Nano-mechanical Behavior And Fly-cutting Subsurface Damage Evaluation Of KDP Crystals
59.	Research On The Mechanism Of Double-sided Planetary Grinding On Sapphire Substrate
60.	Study On The Key Technologies Of Fewer-Axis Arc Envelope Grinding For Large Aspherical Surfaces
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