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Keyword [curing kinetics]
Result: 161 - 180 | Page: 9 of 10
161. Study On The Modification Of Melamine Formaldehyde Resin By Three (2-hydroxyethyl)isocyanurate For Impregnated Resin Paper
162. Synthesis Of Thiourea Modified Dimethylthiotoluenediamine And Its Application In Epoxy Resin
163. Preparation Of Heat Resistant Epoxy Resin For Prepreg And Research Of Its Properties
164. Preparation And Properties Of Toughened And Heat-resistant Bismaleimide Resin For Prepreg
165. Study On Biomass Material Reinforced Epoxy And Its Curing Kinetics
166. Studies On Toughening Characteristics And Mechanism Of Cryogenic Epoxy Resin
167. Molecular Design And Polymer Properties Of Novel Fluorene-containing Benzoxazines
168. Preparation And Application Of High Performance Epoxy Resin Material For Electronic Packaging
169. Rheological Analysis And Low Defect Forming Mechanism During Curing Of Epoxy Resin
170. Preparation And Performance Of Microencapsulated Epoxy Self-healing Materials
171. Preparation And Properties Of Bio-Benzoxazines Based On Furan-Containing Diamines
172. Preparation Of Melamine Formaldehyde Resin With A Low Content Of Free Formaldehyde And High Stability And Its Microwave Foaming
173. Study On Kinetics Of HTPB-based Bonding System
174. Synthesis And Properties Of Novel Biguanide Compounds
175. Storage Aging Of Carbon Fiber/Phenolic Resin Prepreg And Its Composite Forming Process
176. Effect Of Electron Absorption On Poxy/Phenol Ring-opening Reaction And Application In Latent Epoxy Curing System
177. Epoxy/Polyester Powder Coating Optimization Design And Low Temperature Curing Performance
178. Preparation And Properties Of Ionic Liquid-Graphene Conjugated Reinforced Epoxy Composite Based On Microwave Activation
179. Study On Curing Kinetics And Mechanical Properties Of Rapid Curing Epoxy Resin System
180. Preparation And Application Of Solvent-free Polyurea Pigment Printing Adhesive
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