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Keyword [damage layer]
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1. Research On Slicing Mechanism And Technology With Fixed Diamond Wire Saw For Semiconductor Ceramics
2. Molecular Dynamics Study Of Generation Mechanism Of Surface Layer In Nanomechanical Machining Of Crystalline Copper
3. Experimental And Simulation Study On The High-speed And High Efficient Grinding Of The Hardened Steel Of Narrow-and-deep Slot
4. Processing And Surface Quality Of The Crystals Of Cdznte By Control
5. Design Of Acoustic Levitation Polishing Device And Study Of Abrasive Flow
6. Study Of Damage In Crystal Silicon Induced By Nitrogen And Hydrogen Ion Implantation
7. Thermo-chemical Erosion Of Natural Diamond Tools Under Vacuum Atmosphere
8. Research On The Orientation Accuracy And Damage Layer Thickness Of Silicon With Specific Crystallographic Plane Cut By WEDM
9. Research On The Deterioration Layer Of Silicon With Specific Crystallographic Plane Cut By WEDM
10. Analytical Prediction Of Damage Layer Depth Of Ground Surface Of Monocrystalline Silicon Wafers Induced By Ultra-fine Grinding
11. Study On The Law Of Deterioration Strength And Freeze-thaw Loss Layer Of High Ductility Fiber Concrete In Long Brine
12. Study On The Surface/subsurface Characteristic Of PV Polycrystalline Silicon Sawn By Electroplated Diamond Wire Saw
13. Study On Ar~+ Etching Mechanism And Application Of Single Crystal Lithium Niobate Film
14. The Study Of Effects Of Secondary Cutting On Surface Damage Of Monocrystalline Silicon
15. Experimental Study On Grinding Performance Of Nickel-base Superalloy Single Crystal Parts
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